Patents by Inventor Thomas Tsai

Thomas Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250271288
    Abstract: A method includes at a first time, transmitting a first set of ultrasonic pulses from a first location. The method also includes, at a second time, receiving the first set of ultrasonic pulses at a second location. The method also includes, at a third time, transmitting a second set of ultrasonic pulses from the second location. The method also includes, at a fourth time, receiving a first echo of multiple echoes of the first set of ultrasonic pulses at the second location, in which the third time is the same as the first time, or is between the second time and the fourth time. The method also includes, at a fifth time, receiving the second set of ultrasonic pulses at the first location; and providing a flow rate measurement between the first and second locations based on the first time, the second time, the third time, and the fifth time.
    Type: Application
    Filed: February 28, 2024
    Publication date: August 28, 2025
    Inventors: Lei Ding, Thomas Tsai, Christopher Lucci, John Varela Munoz, Ravi Abhishek Shankar, Srinath Ramaswamy
  • Patent number: 11251152
    Abstract: A semiconductor device with reduced device resistance is disclosed. The semiconductor device comprises a semiconductor chip in which the chip thickness at the center portion of the chip where the circuit elements are disposed is uniform and is different from the chip thickness near the chip sides distant from the circuit elements.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: February 15, 2022
    Assignee: DIODES INCORPORATED
    Inventors: Duane Wilcoxen, Chiao-Shun Chuang, Rain Liu, Thomas Tsai, Will Zhang
  • Publication number: 20210288014
    Abstract: A semiconductor device with reduced device resistance is disclosed. The semiconductor device comprises a semiconductor chip in which the chip thickness at the center portion of the chip where the circuit elements are disposed is uniform and is different from the chip thickness near the chip sides distant from the circuit elements.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 16, 2021
    Applicant: Diodes Incorporated
    Inventors: Duane Wilcoxen, Chiao-Shun Chuang, Rain Liu, Thomas Tsai, Will Zhang
  • Publication number: 20150313837
    Abstract: A polymeric hydrogel composition is described for the delivery of a pharmaceutically active agent when an electrical stimulus is applied to the composition. The composition comprises a polymer which forms the hydrogel, such as poly vinyl alcohol (PVA) cross-linked with diethyl acetamidomalonate (DAA), an electroactive polymer such as polyaniline and a pharmaceutically active agent such as an analgesic, and in particular, indomethacin. The composition can be subcutaneously implanted at a targeted site and under normal conditions, the active agent will be entrapped in the hydrogel itself. However, upon the application of an electric current to the hydrogel, the active agent will be released. When the electric current is removed, the change is reversed and the active agent will cease to be released. In one embodiment of the invention, the hydrogel composition is for use in alleviating chronic pain.
    Type: Application
    Filed: April 3, 2015
    Publication date: November 5, 2015
    Inventors: Thomas Tsai, Viness Pillay, Yahya Essop Choonara, Lisa Claire Du Toit
  • Publication number: 20130338569
    Abstract: A polymeric hydrogel composition is described for the delivery of a pharmaceutically active agent when an electrical stimulus is applied to the composition. The composition comprises a polymer which forms the hydrogel, such as poly vinyl alcohol (PVA) cross-linked with diethyl acetamidomalonate (DAA), an electroactive polymer such as polyaniline and a pharmaceutically active agent such as an analgesic, and in particular, indomethacin. The composition can be subcutaneously implanted at a targeted site and under normal conditions, the active agent will be entrapped in the hydrogel itself. However, upon the application of an electric current to the hydrogel, the active agent will be released. When the electric current is removed, the change is reversed and the active agent will cease to be released. In one embodiment of the invention, the hydrogel composition is for use in alleviating chronic pain.
    Type: Application
    Filed: November 28, 2011
    Publication date: December 19, 2013
    Applicant: UNIVERSITY OF WITWATERSRAND, JOHANNESBURG
    Inventors: Thomas Tsai, Viness Pillay, Yahya Essop Choonara, Lisa Claire Du Toit