Abstract: Systems, methods, and apparatuses for workpiece processing with plasma, including thermal isolation of a workpiece holder assembly, are described. An apparatus includes a chamber that at least partially defines a processing space for generating plasma. The apparatus includes a base assembly that at least partially defines a lower end of the chamber and has an inner perimeter that defines an opening in the base assembly. The apparatus further includes a workpiece holder assembly positioned, at least in part, within the opening. The workpiece holder assembly includes heating element(s) and a body with an upper surface configured to receive a workpiece. A gap is defined between the inner perimeter of the base assembly and an outer perimeter of the body. The gap is configured to thermally isolate the base assembly from the body.

Abstract: Apparatus for treating products with plasma generated from a source gas. The apparatus includes a vacuum chamber, a plurality of juxtaposed electrodes arranged in adjacent pairs inside the vacuum chamber, and a plasma excitation source electrically coupled with the electrodes. The apparatus may include conductive members extending into the interior of each electrode to establish a respective electrical connection with the plasma excitation source. The apparatus may include a gas distribution manifold and multiple gas delivery tubes coupled with the gas distribution manifold. Each gas delivery tube has an injection port configured to inject the source gas between each adjacent pair of electrodes. The apparatus may further include flow restricting members that operate to partially obstruct a peripheral gap between each adjacent pair of electrodes, which restricts the escape of the source gas from the process chamber between each adjacent pair of electrodes.

Abstract: A plasma treatment system for treating a workpiece with a downstream-type plasma. The processing chamber of the plasma treatment system includes a chamber lid having a plasma cavity disposed generally between a powered electrode and a grounded plate, a processing space separated from the plasma cavity by the grounded plate, and a substrate support in the processing space for holding the workpiece. A direct plasma is generated in the plasma cavity. The grounded plate is adapted with openings that remove electrons and ions from the plasma admitted from the plasma cavity into the processing space to provide a downstream-type plasma of free radicals. The openings may also eliminate line-of-sight paths for light between the plasma cavity and processing space. In another aspect, the volume of the processing chamber may be adjusted by removing or inserting at least one removable sidewall section from the chamber lid.