Abstract: A leak test apparatus for leak testing a tank including a gas supply system configured to provide to the tank a leak detection gas mixture including hydrogen, a test chamber having a cavity for sealably enclosing the tank such that dead space exists outside the tank and within the cavity, and a gas conduit configured to interconnect the gas supply system and the tank, a control system including a controller programmed to pressurize the tank with the leak detection mixture by flowing gas from the gas supply system through the gas conduit, and a leak detector to determine the presence or absence of a leak in the tank by measuring a concentration of hydrogen in the dead space.

Abstract: A multi-mode combination broadband wireless card and router system includes a broadband wireless card for broadband wireless data communication with a WAN over a broadband wireless link; a router for routing network communications between the WAN and a LAN, the router including a USB port for making a USB connection with a user computer, a wired LAN port for making a wired LAN connection with a user computer, and a wireless LAN port for making a wireless LAN connection with a user computer; at least one of the broadband wireless card and router including a processor; and a module executed by the processor, the module configured to: identify use of at least one of the USB port, the wired LAN port, and the wireless LAN port, and modify network access mode for one or more of the user computers based on the identification.

Abstract: Typical testing of solder joints, (e.g. joints at printed circuit board pads) has not proven totally predictive of the ultimate performance of such joints. It has been found that this lack of reliability is, at least in part, due to the tendency during testing for these pads to lose adhesion to, or delaminate from, the underlying substrate. In contrast, such occurrence is not typical of phenomena induced during typical device usage. To remove this source of unreliability, a test structure is made together with the manufacturing device lot. The same pad processing is used and the pad size is substantially enlarged in the test structure. The test structure is employed to predict performance of devices in the lot and then the lot is processed accordingly.

Abstract: Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.

Abstract: Typical testing of solder joints, (e.g. joints at printed circuit board pads) has not proven totally predictive of the ultimate performance of such joints. It has been found that this lack of reliability is, at least in part, due to the tendency during testing for these pads to lose adhesion to, or delaminate from, the underlying substrate. In contrast, such occurrence is not typical of phenomena induced during typical device usage. To remove this source of unreliability, a test structure is made together with the manufacturing device lot. The same pad processing is used and the pad size is substantially enlarged in the test structure. The test structure is employed to predict performance of devices in the lot and then the lot is processed accordingly.

Abstract: Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.

Abstract: A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal to approximately a melting point of one of the materials. The annealing can reduce growth formations, such as whiskers, on the one or more conductive leads. Lead frames and other devices having plated conductive leads may be subjected to the process, and the resultant plated conductive leads will have fewer growth formations than plated conductive leads not subjected to the process. The plated conductive leads may be trimmed and formed prior to or after the anneal.

Abstract: An exemplary mobile broadband modem for network access comprises a processor coupled to an I/O interface capable of being communicably coupled to a plurality of computers, a transceiver coupled to an antenna and the processor, and a network sharing module executed by the processor that establishes a network connection via the transceiver and allows computer to then utilize the network connection. The mobile broadband modem may include a chassis for securing the PC card modem transceiver within the chassis.