Patents by Inventor Thomas Vago

Thomas Vago has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for Bonding Work pieces and Micro-Structured Component
    Publication number: 20080217381
    Abstract: For forming very strong bond joints suited for manufacturing micro-structured components consisting of plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method.
    Type: Application
    Filed: June 28, 2006
    Publication date: September 11, 2008
    Applicant: Atotech Deutschland GmbH
    Inventors: Heinrich Meyer, Olaf Kurtz, Ralph Herber, Chirstian Madry, Johannes Etzkorn, Thomas Vago