Patents by Inventor Thomas Veit

Thomas Veit has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11920411
    Abstract: A drive unit of a top drive system includes a drive stem having a plurality of ports from an exterior thereof to an interior thereof. A plurality of sliding coupling members is disposed in the ports. A coupling collar encircles the drive stem and has actuation surfaces and recessed surfaces on an interior thereof, wherein the recessed surfaces align with the ports when the coupling collar is in a first position, and the actuation surfaces align with the ports when the coupling collar is in a second position.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: March 5, 2024
    Assignee: WEATHERFORD TECHNOLOGY HOLDINGS, LLC
    Inventors: Michael Henke, Michael Kratzert, Thomas Veit, Kevin Wood
  • Patent number: 11732147
    Abstract: A transparent, elastic, and biocompatible 1K silicone for additive manufacturing that can be printed by stereolithographic processes, includes at least 25-75% by weight of a monomeric or oligomeric dimethacrylate based on silicone or silicone urethanes having a viscosity of <100 Pa·s, 20-50% by weight of one or more monomeric/oligomeric cyclic (meth)acrylates having a viscosity of <0.5 Pa·s, 1-25% by weight of silicone oil having a viscosity of <1 Pa·s, 0.5-20% by weight of fillers with a particle size of <100 ?m, 0.1-5% by weight of one or a combination of a plurality of photoinitiators whose absorption is in the wavelength range of the laser beam or irradiation source used.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: August 22, 2023
    Assignee: DREVE PRODIMED GMBH
    Inventors: Emre Civelek, Thomas Veit
  • Publication number: 20220214752
    Abstract: An image capture device may capture visual content depicting a hand gesture. The hand gesture may identify a subject to be targeted by the image capture device. The targeting of the image capture device (e.g., for stabilization, for focusing) may be changed to be directed at the subject identified by the hand gesture. The image capture device may persistently target the subject identified by the hand gesture for future capture of visual content.
    Type: Application
    Filed: December 21, 2020
    Publication date: July 7, 2022
    Inventors: Maxim Karpushin, Balthazar Neveu, Thomas Veit, Nicolas Rahmouni
  • Publication number: 20220049557
    Abstract: A drive unit of a top drive system includes a drive stem having a plurality of ports from an exterior thereof to an interior thereof. A plurality of sliding coupling members is disposed in the ports. A coupling collar encircles the drive stem and has actuation surfaces and recessed surfaces on an interior thereof, wherein the recessed surfaces align with the ports when the coupling collar is in a first position, and the actuation surfaces align with the ports when the coupling collar is in a second position.
    Type: Application
    Filed: August 31, 2021
    Publication date: February 17, 2022
    Inventors: Michael HENKE, Michael KRATZERT, Thomas VEIT, Kevin WOOD
  • Publication number: 20200325359
    Abstract: A two-component, addition-crosslinking silicone, crosslinking at room temperature or with UV radiation consists essentially of: 0.1-70% by weight polyorganosiloxanes with at least two unsaturated groups in the molecule; 0.1-15% by weight polyorganosiloxanes with at least two SiH groups in the molecule; 0.1-10% by weight polyorganosiloxanes without reactive groups; 0.01-2.0% by weight of noble metal catalyst; 0.1-30% by weight reinforcing fillers, with loaded or unloaded surface; and 0.01-0.5% by weight of at least one antistatic additive.
    Type: Application
    Filed: April 13, 2020
    Publication date: October 15, 2020
    Inventors: Thomas VEIT, Emre CIVELEK
  • Publication number: 20200115571
    Abstract: A transparent, elastic, and biocompatible 1K silicone for additive manufacturing that can be printed by stereolithographic processes, includes at least 25-75% by weight of a monomeric or oligomeric dimethacrylate based on silicone or silicone urethanes having a viscosity of <100 Pa·s, 20-50% by weight of one or more monomeric/oligomeric cyclic (meth)acrylates having a viscosity of <0.5 Pa·s, 1-25% by weight of silicone oil having a viscosity of <1 Pa·s, 0.5-20% by weight of fillers with a particle size of <100 ?m, 0.1-5% by weight of one or a combination of a plurality of photoinitiators whose absorption is in the wavelength range of the laser beam or irradiation source used.
    Type: Application
    Filed: August 27, 2019
    Publication date: April 16, 2020
    Inventors: Emre Civelek, Thomas Veit
  • Patent number: 10224393
    Abstract: A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: March 5, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ewald Karl Michael Günther, Andreas Plöβl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
  • Publication number: 20180252050
    Abstract: Apparatus and methods are for coupling a drive unit to a tool adapter. A drive unit includes a drive stem; a plurality of sliding coupling members; a retainer; a torque profile; a plurality of drive stem ports; a coupling collar; coupling recesses; a plurality of transmission units; and/or first portions of a hydraulic coupling unit. A tool adapter includes a tool stem; a tool stem sleeve; coupling recesses; a torque profile; a plurality of sliding coupling members; and/or second portions of the hydraulic coupling unit. A method of coupling a drive unit to a tool adapter includes positioning the tool adapter below the drive unit; stabbing a drive stem into an interior of a tool stem sleeve; coupling torque between the drive unit and the tool adapter; and coupling load between the drive unit and the tool adapter by engaging a plurality of sliding coupling members.
    Type: Application
    Filed: March 2, 2017
    Publication date: September 6, 2018
    Inventors: Thomas VEIT, Kevin WOOD
  • Patent number: 9972967
    Abstract: A method of producing a laser chip includes providing a semiconductor wafer; creating a plurality of depressions arranged one behind another along a breaking direction on a top side of the semiconductor wafer, wherein 1) each depression includes a front boundary face and a rear boundary face successively in the breaking direction, 2) in at least one depression, the rear boundary face is inclined by an angle of 95° to 170° relative to the top side of the semiconductor wafer, 3) at least one depression includes a shoulder adjacent to the rear boundary face, and 4) the shoulder includes a shoulder face parallel to the top side of the semiconductor wafer and adjacent to the rear boundary face; and breaking the semiconductor wafer in the breaking direction at a breaking plane oriented perpendicularly to the top side of the semiconductor wafer and which runs through the depressions.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: May 15, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Sven Gerhard, Alfred Lell, Joachim Pfeiffer, Jens Mueller, Christoph Eichler, Thomas Veit, Thomas Adlhoch
  • Patent number: 9886435
    Abstract: Various embodiments of systems and methods to provide pseudo internal numbering for uniquely and continuously numbering of legally bound documents are described herein. In one aspect, an external numbering range object (NRO) is generated in a computer system. The range of numbers assignable by the external NRO is split into a set of intervals based on a prefix. In another aspect, an internal NRO is generated corresponding to a subset of the intervals of the external NRO. The correspondence between the internal NRO and the subset of intervals is determined by a part of the prefix. In yet another aspect, the unique and continuous numbers generated by the internal NRO are correlated with the numbers in the intervals of the subset of intervals of the external NRO based on a correspondence between values of the prefix of the external NRO and a prefix of the internal NRO.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: February 6, 2018
    Assignee: SAP SE
    Inventor: Thomas Veit
  • Publication number: 20170345966
    Abstract: A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of removing the transmissive layer within the separating region before starting a separation process with help of a laser, applying an absorbent layer within the separating region, wherein the absorbent layer remains in the separation region during a subsequent separation process with help of a laser, and increasing the absorption coefficient of the transmissive layer within the separating region, and subsequently separating the chip regions along the separating regions by a laser.
    Type: Application
    Filed: August 14, 2017
    Publication date: November 30, 2017
    Inventors: Korbinian Perzlmaier, Heribert Zull, Franz Eberhard, Thomas Veit, Mathias Kämpf, Jens Dennemarck
  • Publication number: 20170271438
    Abstract: A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.
    Type: Application
    Filed: June 6, 2017
    Publication date: September 21, 2017
    Inventors: Ewald Karl Michael Günther, Andreas Plössl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
  • Patent number: 9768344
    Abstract: A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of removing the transmissive layer within the separating region before starting a separation process with help of a laser, applying an absorbent layer within the separating region, wherein the absorbent layer remains in the separation region during a subsequent separation process with help of a laser, and increasing the absorption coefficient of the transmissive layer within the separating region, and subsequently separating the chip regions along the separating regions by a laser.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: September 19, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Korbinian Perzlmaier, Heribert Zull, Franz Eberhard, Thomas Veit, Mathias Kämpf, Jens Dennemarck
  • Publication number: 20170264073
    Abstract: A method of producing a laser chip includes providing a semiconductor wafer; creating a plurality of depressions arranged one behind another along a breaking direction on a top side of the semiconductor wafer, wherein 1) each depression includes a front boundary face and a rear boundary face successively in the breaking direction, 2) in at least one depression, the rear boundary face is inclined by an angle of 95° to 170° relative to the top side of the semiconductor wafer, 3) at least one depression includes a shoulder adjacent to the rear boundary face, and 4) the shoulder includes a shoulder face parallel to the top side of the semiconductor wafer and adjacent to the rear boundary face; and breaking the semiconductor wafer in the breaking direction at a breaking plane oriented perpendicularly to the top side of the semiconductor wafer and which runs through the depressions.
    Type: Application
    Filed: August 27, 2015
    Publication date: September 14, 2017
    Inventors: Sven Gerhard, Alfred Lell, Joachim Pfeiffer, Jens Mueller, Christoph Eichler, Thomas Veit, Thomas Adlhoch
  • Patent number: 9751971
    Abstract: A dispersing resin for conventional solventborne pigment preparations having a low to very low proportion of volatile organic substances is provided. Further provided are solventborne coating materials containing the dispersing resin. Uses include paints, varnishes, adhesives, inks or printing inks, and compositions for coloring of plastics. The pigment preparations produced with these resins are free of yellowing, stable to weathering, of low viscosity and intensely colored.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: September 5, 2017
    Assignee: Evonik Degussa GmbH
    Inventors: Thomas Veit, Michael Ewald, Daniel Engelke, Bettina Burian, Heiko Alzer, Jan Schwarze, Ellen Reuter, Frank Kleinsteinberg, Katrin Roland, Sandra Roediger, Erika Retzlaff, Sylvia Kroes
  • Patent number: 9704945
    Abstract: A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: July 11, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ewald Karl Michael Günther, Andreas Plöβl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
  • Patent number: 9608401
    Abstract: Method for producing semiconductor laser elements (1) comprises A) providing a carrier composite (20) having a plurality of carriers (2) for the semiconductor laser elements (1), B) providing a laser bar (30) having a plurality of semiconductor laser diodes (3) which comprise a common growth substrate (31) and a semiconductor layer sequence (32) grown thereon, C) generating predetermined breaking points (35) on a substrate underside (34) of the growth substrate (31), said substrate underside facing away from the semiconductor layer sequence (32), D) attaching the laser bar (30) to a carrier upper side (23) of the carrier composite (20), wherein the attachment is performed at an elevated temperature and is followed by cooling, and E) singulating into the semiconductor laser elements (1), wherein steps B) to E) are performed in the indicated sequence.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: March 28, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Roland Enzmann, Markus Horn, Markus Graul, Thomas Veit, Juergen Dachs, Stefan Listl, Markus Arzberger
  • Publication number: 20160218241
    Abstract: A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of removing the transmissive layer within the separating region before starting a separation process with help of a laser, applying an absorbent layer within the separating region, wherein the absorbent layer remains in the separation region during a subsequent separation process with help of a laser, and increasing the absorption coefficient of the transmissive layer within the separating region, and subsequently separating the chip regions along the separating regions by a laser.
    Type: Application
    Filed: April 5, 2016
    Publication date: July 28, 2016
    Inventors: Korbinian Perzlmaier, Heribert Zull, Franz Eberhard, Thomas Veit, Mathias Kämpf, Jens Dennemarck
  • Publication number: 20160188579
    Abstract: Various embodiments of systems and methods to provide pseudo internal numbering for uniquely and continuously numbering of legally bound documents are described herein. In one aspect, an external numbering range object (NRO) is generated in a computer system. The range of numbers assignable by the external NRO is split into a set of intervals based on a prefix. In another aspect, an internal NRO is generated corresponding to a subset of the intervals of the external NRO. The correspondence between the internal NRO and the subset of intervals is determined by a part of the prefix. In yet another aspect, the unique and continuous numbers generated by the internal NRO are correlated with the numbers in the intervals of the subset of intervals of the external NRO based on a correspondence between values of the prefix of the external NRO and a prefix of the internal NRO.
    Type: Application
    Filed: December 24, 2014
    Publication date: June 30, 2016
    Inventor: Thomas Veit
  • Publication number: 20160162959
    Abstract: A method includes receiving a request to perform pricing, determining relevant attributes as a subset of multiple pricing attributes by analyzing a pricing configuration, and deriving attribute value combinations based on relevant attributes to provide a reduced set of combinations to pricing. An optional method includes scanning corresponding condition tables for distinct values of each attribute to further reduce attribute value combinations on which to call pricing.
    Type: Application
    Filed: December 5, 2014
    Publication date: June 9, 2016
    Inventors: Wilfried Merkel, Boris Krems, Gururaj Raman, Thomas Veit