Abstract: An integrated circuit package including: a substrate having front connection pads on a front face, an integrated circuit die linked to the front face of the substrate and having front connection pads, connection wires for connecting selected front pads of the integrated circuit die to selected front pads of the substrate, first connection balls on selected front connection pads of the integrated circuit die, and second connection balls on selected front connection pads of the substrate. An integrated circuit device including a second substrate connected to the connection balls of the integrated circuit package.

Abstract: An integrated circuit package including: a substrate having front connection pads on a front face, an integrated circuit die linked to the front face of the substrate and having front connection pads, connection wires for connecting selected front pads of the integrated circuit die to selected front pads of the substrate, first connection balls on selected front connection pads of the integrated circuit die, and second connection balls on selected front connection pads of the substrate. An integrated circuit device including a second substrate connected to the connection balls of the integrated circuit package.

Abstract: A pharmaceutical pellet formulation having a core containing omeprazole as an active ingredient, and also having an outer, enteric coating encasing the core. Titanium dioxide is added to the core, and optionally, to the enteric coating in order to retard decomposition of the omeprazole resulting from the action of penetrating moisture and solvents, thus greatly improving the storage stability of the omeprazole formulation.