Abstract: Locking mechanisms for and methods of securing firearm components in the shoulder stock or butt and/or handgrip of a collapsible firearm. In one example, the locking mechanism may include one or more locking members and a locking mechanism. In another example the locking mechanism may include a cylinder lock. The locking mechanism is configured to secure one or more firearm components in place within a storage compartment of the shoulder stock or butt and/or handgrip of the collapsible firearm, and/or to secure an endcap of the collapsible firearm to the shoulder stock or butt and/or handgrip, thereby rendering the storage compartment a locked container, with the one or more firearm components locked therein.

Abstract: Locking mechanisms for and methods of securing firearm components in the shoulder stock or butt and/or handgrip of a collapsible firearm. In one example, the locking mechanism may include one or more locking members and a locking mechanism. In another example the locking mechanism may include a cylinder lock. The locking mechanism is configured to secure one or more firearm components in place within a storage compartment of the shoulder stock or butt and/or handgrip of the collapsible firearm, and/or to secure an endcap of the collapsible firearm to the shoulder stock or butt and/or handgrip, thereby rendering the storage compartment a locked container, with the one or more firearm components locked therein.

Abstract: A flooring system that may include one or more floor members, wherein the one or more floor members may be configured together to form a floor covering atop an installation surface, which may be a non-dry environment, and wherein one or more of the one or more floor members are secured directly to the installation surface, and wherein the one or more floor members is made of a non-wood decking material. The one or more floor members may include one or more holding floor members, and one or more floating floor members, wherein the one or more holding floor members engage with one or more of the one or more floating floor members to form the floor covering atop the installation surface, and wherein the holding floor members are configured and arranged to secure the floor covering in place atop the installation surface.

Abstract: A flooring system that may include one or more floor members, wherein the one or more floor members may be configured together to form a floor covering atop an installation surface, which may be a non-dry environment, and wherein one or more of the one or more floor members are secured directly to the installation surface, and wherein the one or more floor members is made of a non-wood decking material. The one or more floor members may include one or more holding floor members, and one or more floating floor members, wherein the one or more holding floor members engage with one or more of the one or more floating floor members to form the floor covering atop the installation surface, and wherein the holding floor members are configured and arranged to secure the floor covering in place atop the installation surface.

Abstract: An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burn-in to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation.

Abstract: An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burning to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation.