Patents by Inventor Thomas W. Dalrymple

Thomas W. Dalrymple has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Module with adhesively attached heat sink
    Patent number: 6949415
    Abstract: A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: September 27, 2005
    Assignee: International Business Machines Corporation
    Inventors: David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman
  • Module with adhesively attached heat sink
    Publication number: 20040164401
    Abstract: A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.
    Type: Application
    Filed: February 26, 2004
    Publication date: August 26, 2004
    Inventors: David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman
  • Module with adhesively attached heat sink
    Patent number: 6744132
    Abstract: A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: June 1, 2004
    Assignee: International Business Machines Corporation
    Inventors: David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman
  • Module with adhesively attached heat sink
    Publication number: 20030141586
    Abstract: A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.
    Type: Application
    Filed: January 29, 2002
    Publication date: July 31, 2003
    Applicant: International Business Machines Corporation
    Inventors: David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman