Abstract: A communications system is provided for direct communications between powered elements. A controller hub injects a first message via a modulated communication signal onto a branch circuit using a hub-side power line communication (PLC) coupler. An element-side PLC coupler associated with a powered element in a set of powered elements detects the first message and sends an interrupt to a mini-controller in the powered element. The mini-controller receives the interrupt from the element-side PLC coupler, extracts the first message using the element-side PLC coupler; reads a destination identifier in the first message; compares the destination identifier in the first message to a mini-controller identifier in the mini-controller; sends an acknowledgement message back to the controller hub in response to the destination identifier in the first message matching the mini-controller identifier, and forwards the first message to the powered element.

Abstract: A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through tinned tubes exposed to the surrounding air.

Abstract: A processing module is provided that comprises a set of processing module sides, each comprising a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side couples to another processing module side to form a modular processing module. The modular processing module comprises an exterior connection to a power source and a communication system and a plurality of cold plates coupled to the plurality of processing nodes. Liquid coolant is circulated through the plurality of cold plates via a closed loop by at least one pump through a plurality of tubes and through at least one heat exchanger. The at least one heat exchanger is coupled to an exterior portion of the processing module. The at least one heat exchanger cools the liquid coolant using air surrounding the processing module.

Abstract: A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.

Abstract: A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through finned tubes exposed to the surrounding air.

Abstract: A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.

Abstract: A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.

Abstract: A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through finned tubes exposed to the surrounding air.

Abstract: A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

Abstract: A mechanism is provided for unified management of power, performance, and thermals in computer systems. This mechanism incorporates elements to effectively address all aspects of managing computing systems in an integrated manner, instead of independently. The mechanism employs an infrastructure for real-time measurements feedback, an infrastructure for regulating system activity, component operating levels, and environmental control, a dedicated control structure for guaranteed response/preemptive action, and interaction and integration components. The mechanism provides interfaces for user-level interaction. The mechanism also employs methods to address power/thermal concerns at multiple timescales. In addition, the mechanism improves efficiency by adopting an integrated approach, rather than treating different aspects of the power/thermal problem as individual issues to be addressed in a piecemeal fashion.

Abstract: A weighted event counting system and method for processor performance measurements provides low latency and low error performance measurement capability. A weighted performance counter accumulates a performance count according to a plurality of event signals provided from functional units in the processor. Differing weights are applied to the event signals in according to the correlation between each event with processor performance. The weights may be provided from programmable registers, so that the weights can be adjusted under program control. The event signals may be combined to reduce the bit-width of the set of event signal, with mutually-exclusive events merged in single fields of the combinatorial result and events having the same weights merged according to a sub-total. The weights are applied to the combinatorial result and used to update a performance count. The performance count can then be used by power management software or hardware to make adjustments in operating parameters of the processor.

Abstract: A system is provided for unified management of power, performance, and thermals in computer systems. This system incorporates elements to effectively address all aspects of managing computing systems in an integrated manner, instead of independently. The system employs an infrastructure for real-time measurements feedback, an infrastructure for regulating system activity, component operating levels, and environmental control, a dedicated control structure for guaranteed response/preemptive action, and interaction and integration components. The system provides interfaces for user-level interaction. The system also employs methods to address power/thermal concerns at multiple timescales. In addition, the system improves efficiency by adopting an integrated approach, rather than treating different aspects of the power/thermal problem as individual issues to be addressed in a piecemeal fashion.

Abstract: A weighted event counting system and method for processor performance measurements provides low latency and low error performance measurement capability. A weighted performance counter accumulates a performance count according to a plurality of event signals provided from functional units in the processor. Differing weights are applied to the event signals in according to the correlation between each event with processor performance. The weights may be provided from programmable registers, so that the weights can be adjusted under program control. The event signals may be combined to reduce the bit-width of the set of event signal, with mutually-exclusive events merged in single fields of the combinatorial result and events having the same weights merged according to a sub-total. The weights are applied to the combinatorial result and used to update a performance count. The performance count can then be used by power management software or hardware to make adjustments in operating parameters of the processor.