Abstract: A coating system that includes a plurality of portions, each portion comprising one or more layers. The coating system includes an outer portion, which is an infrared radiation (IR) interaction portion, that dissipates incident (IR). Underlying this outer portion is a performance portion. The performance portion comprises at least one layer that includes microspheres. Between the substrate and performance portion is a compliance portion. The compliance portion comprises at least one layer of high temperature material that has a coefficient of thermal expansion (CTE) intermediate the performance layer and the substrate. The compliance portion thus reduces any high temperature thermal mismatch between the substrate and the performance portion.

Abstract: A coating system that includes a plurality of portions, each portion comprising one or more layers. The coating system includes an outer portion, which is an infrared radiation (IR) interaction portion, that dissipates incident (IR). Underlying this outer portion is a performance portion. The performance portion comprises at least one layer that includes microspheres. Between the substrate and performance portion is a compliance portion. The compliance portion comprises at least one layer of high temperature material that has a coefficient of thermal expansion (CTE) intermediate the performance layer and the substrate. The compliance portion thus reduces any high temperature thermal mismatch between the substrate and the performance portion.

Abstract: A method for machining a component. The method includes providing a machining apparatus configured to induce vibrations such that a vibration direction of the machining apparatus is substantially aligned with respect to a machining direction of the component, and vibrating the machining apparatus in the vibration direction to machine the component in the machining direction.

Abstract: A method for machining a component. The method includes providing a machining apparatus configured to induce vibrations such that a vibration direction of the machining apparatus is substantially aligned with respect to a machining direction of the component, and vibrating the machining apparatus in the vibration direction to machine the component in the machining direction.

Abstract: A method for machining a component. The method includes providing a machining apparatus configured to induce vibrations such that a vibration direction of the machining apparatus is substantially aligned with respect to a machining direction of the component, and vibrating the machining apparatus in the vibration direction to machine the component in the machining direction.

Abstract: A method of forming a multilayer ceramic coating system on a substrate that requires thermal protection from a hostile thermal environment. The method generally entails forming at least one tape that contains ceramic particles dispersed in an organic constituent, such as a binder and/or plasticizer. If a single tape is used, the tape is formed of multiple layers of different compositions and applied as a unit to the substrate, thereby forming at least an innermost layer and an outermost layer on the substrate. If multiple tapes are used, a first tape is applied to the substrate to form the innermost layer, and a second tape is applied to form the outermost layer. The tape/tapes are then sintered to form innermost and outermost ceramic layers, respectively, on the substrate.

Abstract: A method of forming a multilayer ceramic coating system on a substrate that requires thermal protection from a hostile thermal environment. The method generally entails forming at least one tape that contains ceramic particles dispersed in an organic constituent, such as a binder and/or plasticizer. If a single tape is used, the tape is formed of multiple layers of different compositions and applied as a unit to the substrate, thereby forming at least an innermost layer and an outermost layer on the substrate. If multiple tapes are used, a first tape is applied to the substrate to form the innermost layer, and a second tape is applied to form the outermost layer. The tape/tapes are then sintered to form innermost and outermost ceramic layers, respectively, on the substrate.