Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Abstract: A preferred embodiment of the invention provides a device having a structural element, which has magnetic properties that are dependent on the hydrogen content in the structural element, the structural element containing hydrogen. In a preferred embodiment, the magnetic properties of a material are altered by the introduction of hydrogen, for example in order to convert an otherwise ferromagnetic material into a paramagnetic material. For example, in a structural element made from a ferromagnetic base material, a first region can be converted with the aid of hydrogen into a paramagnetic region which adjoins a second, hydrogen-free region. This makes it possible to fabricate magnetic heterostructures from a single base material without it being necessary to alter the geometric dimensions of the structural element, for example by lithographic structuring and subsequent etching.