Abstract: Interactive analytics are provided for resource allocation failure incidents, which may be tracked, diagnosed, summarized, and presented in near real-time for users and/or platform/service providers to understand the root cause(s) of failure incidents and actual and hypothetical, failed and successful, allocation scenarios. A capacity analyzer simulates an allocation process implemented by a resource allocation platform. The capacity analyzer may determine which resources were and/or were not eligible for allocation for a request, based on information about the resource allocation failure, resources in the region of interest, and constraints associated with the incident, and the resource allocation rules associated with the resource allocation platform. Users may quickly learn whether a request constraint, a requesting entity constraint, a capacity constraint, and/or a resource platform constraint caused a resource allocation incident.

Abstract: Systems, methods, and apparatuses for real-time trickle payments are provided. A system includes a processing circuit configured to: receive a request from a consumer device to commission a service provided by a supplier; place a financial hold on funds allocated to a supplier financial account based on performance terms of a smart contract; detect initiation of performance of the requested service based on performance information from a mobile device associated with the supplier and correlating the performance information to the smart contract; increase a financial hold on funds allocated to a consumer financial account in a hold amount proportional to the monitored performance, and decrease the financial hold on the funds allocated to the supplier financial account in the hold amount proportional to the monitored performance; and, upon the completion of the requested service, release the funds on hold in the supplier financial account.

Abstract: This disclosure relates to a device for detecting the temperature of an electric coupling element. The device includes an electric contact element which is designed to conduct an electric current to an electric component. A component support is also included and arranged on the contact element and includes a thermally conductive region in direct contact with the contact element. The component support is equipped with a printed circuit board which includes at least one temperature sensor that detects the temperature of the electric coupling element.

Abstract: A semiconductor lamp (1) has at least one semiconductor light source (8) arranged on a front face (7) of a substrate (6) and a driver circuit (11) for activating the at least one semiconductor light source (8), at least part of the driver circuit (11) being secured on a rear face (10) of the substrate (6), facing away from the at least one semiconductor light source (8). The invention can be used, in particular, for retrofit lamps, in particular incandescent- or halogen retrofit lamps.

Abstract: A semiconductor lamp (1) has at least one semiconductor light source (8) arranged on a front face (7) of a substrate (6) and a driver circuit (11) for activating the at least one semiconductor light source (8), at least part of the driver circuit (11) being secured on a rear face (10) of the substrate (6), facing away from the at least one semiconductor light source (8). The invention can be used, in particular, for retrofit lamps, in particular incandescent- or halogen retrofit lamps.