Abstract: A semiconductor wafer is provided including a plurality of dies, each of the plurality of dies including a plurality of semiconductor devices, a plurality of die seals, each of the plurality of die seals being formed at a perimeter of one of the plurality of dies, and a plurality of electrically conductive links, each of the plurality of conductive links connecting one of the plurality of die seals with another one of the plurality of die seals.

Abstract: A washer fluid pump (2) for a windshield washer system (3) of a motor vehicle has ventilation ducts (25, 25?) which are arranged in a housing (17) parallel to the longitudinal axis. The ventilation ducts (25, 25?) open out behind bulkheads (21, 22) which are likewise arranged parallel to the longitudinal axis. The bulkheads (21, 22) bridge a constriction (20), which is arranged between an electric motor (15) and a pump stage (16), of the housing (17). In this way, the electric motor (15) is reliably protected against spray water. The washer fluid pump (2) can also be produced in a particularly cost-effective manner.

Abstract: A method for determining a flow speed of a liquid in a fluid conduit is provided. During a signal-generating phase, an impulse signal is applied to a first ultrasonic transducer. A response signal is then received at a second ultrasonic transducer. A measuring signal is later derived from the response signal, wherein the derivation comprises reversing a signal portion with respect to time. During a measurement phase, a liquid moves with respect to the fluid conduit. The measuring signal is then applied to one of the two transducers and a response signal of the measuring signal is measured at the other transducer. A flow speed is derived from the response signal of the measuring signal.

Abstract: Various technologies described herein pertain to managing and accessing a community Wi-Fi network. The community Wi-Fi network can include sharer computing devices in differing local networks that share respective network bandwidth capacities with consumer computing devices. Feedback information pertaining to network bandwidth capacity available at different geographic locations covered by the community Wi-Fi network can be collected and evaluated to enable generation of maps for visualizing coverage of the community Wi-Fi network. A consumer computing device can display a map that includes visual information pertaining to the geographic coverage of the community Wi-Fi network relative to a geographic location of the consumer computing device.

Abstract: A method and a system for processing multimodal input signals, wherein the system includes a merging unit which receives instruction messages from a sensor data evaluation device, which messages each indicate an instruction which can be executed by an application which can be coupled to the merging unit. For at least two of the instruction messages, the merging unit respectively generates a candidate object for the instruction message, the candidate object respectively indicating the instruction and respectively including a validity time specification of the candidate object. The merging unit also merges two of the candidate objects if the validity time specifications of these candidate objects indicate overlapping validity times and to forward an instruction to the application, which instruction is indicated by a candidate object which results from the merging operation.

Abstract: Systems and methods are provided for regulating the transfer of energy inductively between an implantable device and an external charging system, wherein the energy transfer rate is regulated by varying an operating frequency of an inductive energy transfer circuit of the implantable device responsive a temperature measured within the implantable device.

Abstract: A method and a system for processing multimodal input signals, wherein the system includes a merging unit which receives instruction messages from a sensor data evaluation device, which messages each indicate an instruction which can be executed by an application which can be coupled to the merging unit. For at least two of the instruction messages, the merging unit respectively generates a candidate object for the instruction message, the candidate object respectively indicating the instruction and respectively including a validity time specification of the candidate object. The merging unit also merges two of the candidate objects if the validity time specifications of these candidate objects indicate overlapping validity times and to forward an instruction to the application, which instruction is indicated by a candidate object which results from the merging operation.

Abstract: An assembly is provided that includes a mineral-based monolithic support for full-surface supporting of a workpiece during processing and transportation and a workpiece supported thereon, wherein the surface of the support is designed so that adherence of the supported workpiece is prevented, and wherein the support has provisions with means inserted therein, which permit to lift the workpiece from the support from below and/or to shift the workpiece laterally, and furthermore relates to a mineral-based monolithic support suitable for this purpose.

Abstract: Embodiments control submission of crowdsourced data from a computing device to a cloud service. The cloud service receives a packet from the computing device having collected data and a single-use data tag associated therewith. The single-use data tag represents one of a threshold quantity of single-use data tags issued to the computing device. The cloud service validates the single-use data tag in the received packet by, for example, searching for the single-use data tag in a tag store maintained by the cloud service. The collected data from the received packet is stored by the cloud service based on the validation. After validation, the tag store is updated to prevent re-use of the single-use data tag. In some embodiments, the cloud service is a location service receiving crowdsourced beacon fingerprint data from a plurality of mobile computing devices.

Abstract: The present disclosure provides gene expression profiles that are associated with prostate cancer, including certain gene expression profiles that differentiate between subjects of African and Caucasian descent and other gene expression profiles that are common to subjects of both African and Caucasian descent. The gene expression profiles can be measured at the nucleic acid or protein level and used to stratify prostate cancer based on ethnicity or the severity or aggressiveness of prostate cancer. The gene expression profiles can also be used to identify a subject for prostate cancer treatment. Also provided are kits for diagnosing and prognosing prostate cancer and an array comprising probes for detecting the unique gene expression profiles associated with prostate cancer in subjects of African or Caucasian descent.

Abstract: The present disclosure provides genomic arrangements of the chromosome 3q13 region that are associated with prostate cancer, such as rearrangements between the ZBTB20 and LSAMP genes, including gene fusions between the ZBTB20 gene and the LSAMP gene and deletions spanning both genes. The ZBTB20/LSAMP genomic rearrangement serves as a biomarker for prostate cancer and can be used to stratify prostate cancer based on ethnicity or the severity or aggressiveness of prostate cancer and/or identify a patient for prostate cancer treatment. Another aspect involves discovering that deletions of the PTEN gene are observed predominately in prostate cancer from subjects of Caucasian descent. Also provided are kits for diagnosing and prognosing prostate cancer.

Abstract: A semiconductor structure includes a semiconductor substrate, one or more interconnect layers provided over the substrate and a circuit. The circuit includes a plurality of circuit elements formed at the substrate and a plurality of electrical connections provided in the one or more interconnect layers. A die seal is provided in the one or more interconnect layers. A die seal leakage detection material is arranged in the one or more interconnect layers between the die seal and the plurality of electrical connections. The die seal provides a protection of the die seal leakage detection material from moisture if the die seal is intact. The die seal leakage detection material is adapted for providing a detectable modification of the circuit after an exposure of the die seal leakage detection material to moisture.

Abstract: In a method for parameterizing an electrical device, a communication link is set up between a user unit and a computation apparatus. The latter provides a parameterization program for parameterizing the electrical device. The user unit is used to record settings made at the user end that affect the electrical device, and the recorded settings are used to form setting values for parameterizing the electrical device. A parameterization file containing the setting values is produced for the electrical device. In order to be able to perform parameterization of electrical devices, in particular electrical devices that are used in automation installations in a safety-critical environment, in a comparatively simple and inexpensive manner, the parameterization program for parameterizing the electrical device is executed by the computation apparatus and a user interface for the parameterization program is displayed by the user unit.

Abstract: A method of forming a semiconductor device including an inductor is provided, including forming a first dielectric layer of a first dielectric material over a substrate, removing part of the first dielectric layer to create an opening in the first dielectric layer, filling the opening with a second dielectric layer of a second dielectric material different from the first dielectric material, forming a trench in the second dielectric layer, and filling the trench with a conductive material to form an inductor coil. A semiconductor device is provided that includes a first dielectric layer made of a first dielectric material, a second dielectric layer made of a second dielectric material different from the first dielectric material and embedded in the first dielectric layer and a trench filled with a conductive material and formed in the second dielectric layer, representing at least a part of an inductor coil of the inductor.

Abstract: A semiconductor wafer is provided including a plurality of dies, each of the plurality of dies including a plurality of semiconductor devices, a plurality of die seals, each of the plurality of die seals being formed at a perimeter of one of the plurality of dies, and a plurality of electrically conductive links, each of the plurality of conductive links connecting one of the plurality of die seals with another one of the plurality of die seals.

Abstract: Various technologies described herein pertain to configuring an access point in a local network for operation in a community Wi-Fi network. The community Wi-Fi network includes access points in differing local networks that share respective network bandwidth capacities with member computing devices of the community Wi-Fi network. A request to join the access point to the community Wi-Fi network is transmitted from the access point to a community aggregation system. Responsive to the request, the community aggregation system transmits a firmware update to the access point. The access point installs the firmware update in memory of the access point. Moreover, responsive to installation of the firmware update, the access point can share network bandwidth capacity with the member computing devices of the community Wi-Fi network. Further, the community aggregation system supports transparent handoffs between access points in to the community Wi-Fi network.

Abstract: In a method of forming a three-dimensional semiconductor device, a first chip is provided that includes a first substrate, a first device layer positioned on and covering the first substrate, and a first metallization system positioned on and covering the first device layer, wherein the first device layer includes a plurality of first transistor elements. A second chip is also provided and includes a second substrate, a second device layer positioned on and covering the second substrate, and a second metallization system positioned on and covering the second device layer, wherein the second device layer includes a plurality of second transistor elements. The second chip is attached to the first chip so that a heat spreading material is positioned between the first chip and the second chip and covers at least a portion of the first metallization system.

Abstract: The present disclosure relates to a semiconductor structure including a plurality of connecting lines arranged on a plurality of vertical levels, the plurality of connecting lines including at least a first connecting line arranged in a first vertical level and a second connecting line arranged in a second vertical level, different from the first vertical level, and a breakdown prevention layer placed in at least part of the vertical space separating the first connecting line from the second connecting line.

Abstract: A semiconductor wafer is provided including a plurality of dies, each of the plurality of dies including a plurality of semiconductor devices, a plurality of die seals, each of the plurality of die seals being formed at a perimeter of one of the plurality of dies, and a plurality of electrically conductive links, each of the plurality of conductive links connecting one of the plurality of die seals with another one of the plurality of die seals.

Abstract: In the case of a window cleaning system for a motor vehicle, a washing fluid line (6) is manufactured integrally with plug-type coupling parts (8). Movable components and a sealing ring (15) are arranged on bushing-type coupling parts (9). The bushing-type coupling parts (9) are arranged on a washing fluid pump (2), on washing nozzles (4) and on a T connector (7). By this means, the window cleaning system is constructed in a particularly simple manner and can be manufactured cost-effectively.