Abstract: Systems and methods are described for interpreting machine learning model predictions. An example method includes: providing a machine learning model configured to receive a plurality of features as input and provide a prediction as output, wherein the plurality of features includes an engineered feature including a combination of two or more parent features; calculating a Shapley value for each feature in the plurality of features; and allocating a respective portion of the Shapley value for the engineered feature to each of the two or more parent features.

Abstract: Systems and methods are described for interpreting machine learning model predictions. An example method includes: providing a machine learning model configured to receive a plurality of features as input and provide a prediction as output, wherein the plurality of features includes an engineered feature including a combination of two or more parent features; calculating a Shapley value for each feature in the plurality of features; and allocating a respective portion of the Shapley value for the engineered feature to each of the two or more parent features.

Abstract: A printed circuit board with a printed pattern of fiducial marks on a first side of the printed circuit board including a first indicia including a right triangle with its base parallel to a first edge of the board and an alignment mark adjacent thereto, and a second indicia including a right triangle with its base parallel to a second edge of the board opposite said first edge, and an alignment mark adjacent thereto.

Abstract: A single chip integrated circuit for use in an optical transceiver for converting and coupling an information containing electrical signal with an optical fiber having an XFI interface for coupling with an external electrical cable or information system device, and an XAUI interface for coupling with a laser transmitter subassembly including first, second, third and fourth lasers operating at different wavelengths and modulated by the respective four lane XAUI signals. The circuit includes an encoder for encoding the incoming XFI signal into four signals in the XAIU format, and a decoder coupled to the XAUI interface for receiving a four lane XAUI signal and converting it into a serial XFI signal coupled to the XFI interface.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.

Abstract: A printed circuit board with a printed pattern of fiducial marks on a first side of the printed circuit board including a first indicia including a right triangle with its base parallel to a first edge of the board and an alignment mark adjacent thereto, and a second indicia including a right triangle with its base parallel to a second edge of the board opposite said first edge, and an alignment mark adjacent thereto.

Abstract: A hermetically sealed optical transmitter module for use in an optical transceiver converting and coupling an information-containing electrical signal with an optical fiber. A plurality of semiconductor lasers are provided on a common support in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal according to a standardized optical communications protocol, such as the IEEE 802.3ae 10 Gigabit BASE LX4 physical layer.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.

Abstract: An optical transceiver for including an electrical connector with a serial interface for coupling with an external electrical cable or information system device, a fiber optic connector adapted for coupling with an external optical fiber, and an electro-optical subassembly for converting between an information containing electrical signal and a modulated optical signal corresponding to the electrical signal including a transmitter subassembly including at least first and second lasers operating at different wavelengths and modulated with respective first and second electrical signals for emitting first and second laser light beams, and an optical multiplexer for receiving the first and second beams and multiplexing the respective optical signals into a single multi-wavelength beam.

Abstract: A single chip integrated circuit for use in an optical transceiver for converting and coupling an information containing electrical signal with an optical fiber having an XFI interface for coupling with an external electrical cable or information system device, and an XAUI interface for coupling with a laser transmitter subassembly including first, second, third and fourth lasers operating at different wavelengths and modulated by the respective four lane XAUI signals. The circuit includes an encoder for encoding the incoming XFI signal into four signals in the XAIU format, and a decoder coupled to the XAUI interface for receiving a four lane XAUI signal and converting it into a serial XFI signal coupled to the XFI interface.

Abstract: An optical transceiver for including an electrical connector with a serial interface for coupling with an external electrical cable or information system device, a fiber optic connector adapted for coupling with an external optical fiber, and an electro-optical subassembly for converting between an information containing electrical signal and a modulated optical signal corresponding to the electrical signal including a transmitter subassembly including at least first and second lasers operating at different wavelengths and modulated with respective first and second electrical signals for emitting first and second laser light beams, and an optical multiplexer for receiving the first and second beams and multiplexing the respective optical signals into a single multi-wavelength beam.

Abstract: A printed circuit board with a printed pattern of fiducial marks on a first side of the printed circuit board including a first indicia including a right triangle with its base parallel to a first edge of the board and an alignment mark adjacent thereto, and a second indicia including a right triangle with its base parallel to a second edge of the board opposite said first edge, and an alignment mark adjacent thereto.

Abstract: A hermetically sealed optical transmitter module for use in an optical transceiver converting and coupling an information-containing electrical signal with an optical fiber. A plurality of semiconductor lasers are provided on a common support in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal according to a standardized optical communications protocol, such as the IEEE 802.3ae 10 Gigabit BASE LX4 physical layer.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.

Abstract: A sheet material having a decorative surface and a working surface, for application to a support surface is disclosed, the working surface of which is provided with a continuous coating of tacky, pressure-sensitive, adhesive, which adhesive is provided with a coating of a discontinuous layer of resilient, non-adhesive particles. The coating of particles have the ability to be deformed under a load and thus, upon application to a support surface, deform, under pressure, to such an extent as to bring the adhesive and the surface into fuller contact.

Abstract: A flexible sheet material provided with a flexible coating of an organic material which is curable on exposure to actinic light to produce a less flexible coating on the sheet. The coated sheet is rolled up for storage in the absence of actinic light such that when the sheet is unrolled and attached to a wall or other surface so exposing the coating to actinic light, a less flexible coating on the sheet results.