Abstract: A die assembly and a method of forming a vinyl record are provided. The assembly includes a base circular-shaped plate having an outer ring-shaped gasket groove, an inner O-ring groove, and a plurality of concentric grooves extending from a primary surface into the base circular-shaped plate. The assembly includes an O-ring that is disposed in the inner O-ring groove, and an outer ring-shaped gasket disposed in the outer ring-shaped gasket groove. The assembly includes a contacting circular-shaped plate having an engagement surface and a plurality of concentric channels such that a plurality of concentric finger portions are formed on the contacting circular-shaped plate. The plurality of concentric finger portions are partially disposed in the plurality of concentric grooves and contact the base circular-shaped plate.

Abstract: A method for communicating data between peripheral devices and an embedded processor that includes receiving, at a data buffer unit of the embedded processor, the data from a peripheral device. The method also includes copying data from the data buffer unit into the bridge buffer of the embedded processor as a bridge buffer message. Additionally, the method includes creating, after storing the data as a bridge buffer message, a peripheral device message comprising the bridge buffer message, and sending the peripheral device message to a thread message queue of a subscriber.

Abstract: A method for communicating data between peripheral devices and an embedded processor that includes receiving, at a data buffer unit of the embedded processor, the data from a peripheral device. The method also includes copying data from the data buffer unit into the bridge buffer of the embedded processor as a bridge buffer message. Additionally, the method includes creating, after storing the data as a bridge buffer message, a peripheral device message comprising the bridge buffer message, and sending the peripheral device message to a thread message queue of a subscriber.