Patents by Inventor Thomas William Kenny, Jr.

Thomas William Kenny, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7061104
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: June 13, 2006
    Assignee: Cooligy, Inc.
    Inventors: Thomas William Kenny, Jr., Kenneth E. Goodson, Juan G. Santiago, George Carl Everett, Jr.
  • Patent number: 7050308
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: May 23, 2006
    Assignee: Cooligy, Inc.
    Inventors: Thomas William Kenny, Jr., Kenneth E. Goodson, Juan G. Santiago, George Carl Everett, Jr.
  • Patent number: 7019972
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: March 28, 2006
    Assignee: Cooligy, Inc.
    Inventors: Thomas William Kenny, Jr., Kenneth E. Goodson, Juan G. Santiago, George Carl Everett, Jr.
  • Patent number: 6882543
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Grant
    Filed: March 7, 2003
    Date of Patent: April 19, 2005
    Assignee: Cooligy, Inc.
    Inventors: Thomas William Kenny, Jr., Kenneth E. Goodson, Juan G. Santiago, George Carl Everett, Jr.
  • Patent number: 6678168
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: January 13, 2004
    Assignee: Cooligy, Inc.
    Inventors: Thomas William Kenny, Jr., Kenneth E. Goodson, Juan G. Santiago, John J. Kim, Robert C. Chaplinsky, George Carl Everett, Jr.
  • Patent number: 6606251
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Grant
    Filed: February 7, 2002
    Date of Patent: August 12, 2003
    Assignee: Cooligy Inc.
    Inventors: Thomas William Kenny, Jr., Kenneth E. Goodson, Juan G. Santiago, George Carl Everett, Jr.