Patents by Inventor THOMAS WOERZ

THOMAS WOERZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11337300
    Abstract: An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: May 17, 2022
    Assignee: E.SOLUTIONS GMBH
    Inventors: Martin Wanner, Meik Wilhelm Widmer, Thomas Woerz
  • Publication number: 20200367355
    Abstract: An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.
    Type: Application
    Filed: August 6, 2020
    Publication date: November 19, 2020
    Inventors: Martin Wanner, Meik Wilhelm Widmer, Thomas Woerz
  • Patent number: 10779393
    Abstract: An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: September 15, 2020
    Assignee: E.SOLUTIONS GMBH
    Inventors: Martin Wanner, Meik Wilhelm Widmer, Thomas Woerz
  • Publication number: 20180103539
    Abstract: An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.
    Type: Application
    Filed: December 8, 2017
    Publication date: April 12, 2018
    Applicant: e.solutions GmbH
    Inventors: MARTIN WANNER, MEIK WILHELM WIDMER, THOMAS WOERZ
  • Patent number: 9877380
    Abstract: An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: January 23, 2018
    Assignee: E. SOLUTIONS GmbH
    Inventors: Martin Wanner, Meik Wilhelm Widmer, Thomas Woerz
  • Publication number: 20160227642
    Abstract: An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.
    Type: Application
    Filed: January 29, 2016
    Publication date: August 4, 2016
    Applicant: e.solutions GmbH
    Inventors: MARTIN WANNER, MEIK WILHELM WIDMER, THOMAS WOERZ