Patents by Inventor Thomas Wojtacki

Thomas Wojtacki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10091902
    Abstract: An electrical module is configured to be coupled to a tray of a battery distribution assembly. The electrical module includes a housing disposed along an outer surface of the tray. The electrical module also includes at least one electrical circuit device disposed within a cavity of the housing. The electrical module further includes multiple terminals electrically connected to the at least one electrical circuit device. The terminals project outward from the housing and extend through corresponding apertures in the tray for electrically connecting to one or more electrical conductors disposed along an inner surface of the tray.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: October 2, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Zachary Wood Lyon, Thomas Wojtacki, Jeremy Christin Patterson
  • Publication number: 20170150630
    Abstract: An electrical module is configured to be coupled to a tray of a battery distribution assembly. The electrical module includes a housing disposed along an outer surface of the tray. The electrical module also includes at least one electrical circuit device disposed within a cavity of the housing. The electrical module further includes multiple terminals electrically connected to the at least one electrical circuit device. The terminals project outward from the housing and extend through corresponding apertures in the tray for electrically connecting to one or more electrical conductors disposed along an inner surface of the tray.
    Type: Application
    Filed: November 23, 2015
    Publication date: May 25, 2017
    Inventors: Zachary Wood Lyon, Thomas Wojtacki, Jeremy Christin Patterson
  • Patent number: 6872098
    Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: March 29, 2005
    Assignee: Tyco Electronics Corporation
    Inventors: Thomas Wojtacki, Kevin J. Peterson, Kurt T. Zarbock, Joseph E. Geniac, William J. Remaley, Michael G. Pacyga, Aurelio J. Gutierrez
  • Publication number: 20030077941
    Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.
    Type: Application
    Filed: July 31, 2002
    Publication date: April 24, 2003
    Inventors: Thomas Wojtacki, Kevin J. Peterson, Kurt T. Zarbock, Joseph E. Geniac, William J. Remaley, Michael G. Pacyga, Aurelio J. Gutierrez
  • Patent number: 6511348
    Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.
    Type: Grant
    Filed: October 19, 2001
    Date of Patent: January 28, 2003
    Assignee: Tyco Electronics Corporation
    Inventors: Thomas Wojtacki, Kevin J. Peterson, Kurt T. Zarbock, Joseph E. Geniac, William J. Remaley, Michael G. Pacyga