Patents by Inventor Thomas Wolfsteiner

Thomas Wolfsteiner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONNECTOR ASSEMBLY, SYSTEM AND LITHOGRAPHY INSTALLATION
    Publication number: 20220200181
    Abstract: A connector arrangement includes a first connector element, a second connector element, a first printed circuit board section and a second printed circuit board section. The second connector element can be plugged together with the first connector element in an insertion direction to form an electrical connection. The first connector is mounted on the first printed circuit board section. The first printed circuit board section is mounted on the second printed circuit board section such that the first printed circuit board section is movable perpendicularly to the insertion direction. This can bring about tolerance compensation when the first and second connector elements are plugged together.
    Type: Application
    Filed: March 15, 2022
    Publication date: June 23, 2022
    Inventor: Thomas Wolfsteiner
  • Component for a projection exposure apparatus
    Patent number: 10866528
    Abstract: A component for a projection exposure apparatus includes a printed circuit board arranged in an encapsulated housing and having electronic component parts, and a heat conducting structure for dissipating heat from the electronic component parts to an outer side of the housing.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: December 15, 2020
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Thomas Wolfsteiner, Stefan Krone, Volker Wieczorek, Lars Berger
  • COMPONENT FOR A PROJECTION EXPOSURE APPARATUS
    Publication number: 20190324372
    Abstract: A component for a projection exposure apparatus includes a printed circuit board arranged in an encapsulated housing and having electronic component parts, and a heat conducting structure for dissipating heat from the electronic component parts to an outer side of the housing.
    Type: Application
    Filed: July 1, 2019
    Publication date: October 24, 2019
    Inventors: Thomas Wolfsteiner, Stefan Krone, Volker Wieczorek, Lars Berger