Patents by Inventor Thomas Wowra
Thomas Wowra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9147649Abstract: A multi-chip module and method is disclosed. One embodiment provides an electronic module having a first metal structure and a second metal structure. A first semiconductor chip is electrically connected with its back side to the first metal structure. A second semiconductor chip is arranged with its back side lying over the front side of the first semiconductor chip. The second metal structure includes multiple external contact elements attached over the front side of the second semiconductor chip. At least two of the multiple external contact elements are electrically connected to the front side of the second semiconductor chip.Type: GrantFiled: January 24, 2008Date of Patent: September 29, 2015Assignee: Infineon Technologies AGInventors: Stefan Landau, Joachim Mahler, Thomas Wowra
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Patent number: 9123708Abstract: The semiconductor chip package comprises a carrier, a semiconductor chip comprising a first main face and a second main face opposite to the first main face, chip contact elements disposed on one or more of the first or second main faces of the semiconductor chip, an encapsulation layer covering the first main face of the semiconductor chip, the encapsulation layer comprising a first main face facing the carrier and a second main face remote from the carrier, first contact elements disposed on the second main face of the encapsulation layer, each one of the first contact elements being connected to one of the chip contact elements, and second contact elements disposed on the first main face of the encapsulation layer, each one of the second contact elements being connected to one of the chip contact elements.Type: GrantFiled: March 1, 2013Date of Patent: September 1, 2015Assignee: Infineon Technologies Austria AGInventors: Khalil Hosseini, Thomas Wowra, Joachim Mahler, Ralf Wombacher
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Patent number: 9093416Abstract: A chip-package includes a chip-carrier configured to carry a chip, the chip arranged over a chip-carrier side, wherein the chip-carrier side is configured in electrical connection with a chip back side; an insulation material including: a first insulation portion formed over a first chip lateral side; a second insulation portion formed over a second chip lateral side, wherein the first chip lateral side and the second chip lateral side each abuts opposite edges of the chip back side; and a third insulation portion formed over at least part of a chip front side, the chip front side including one or more electrical contacts formed within the chip front side; wherein at least part of the first insulation portion is arranged over the chip-carrier side and wherein the first insulation portion is configured to extend in a direction perpendicular to the first chip lateral side further than the chip-carrier.Type: GrantFiled: November 28, 2011Date of Patent: July 28, 2015Assignee: INFINEON TECHNOLOGIES AGInventors: Manfred Mengel, Thomas Wowra, Joachim Mahler, Khalil Hosseini
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Publication number: 20140246766Abstract: The semiconductor chip package comprises a carrier, a semiconductor chip comprising a first main face and a second main face opposite to the first main face, chip contact elements disposed on one or more of the first or second main faces of the semiconductor chip, an encapsulation layer covering the first main face of the semiconductor chip, the encapsulation layer comprising a first main face facing the carrier and a second main face remote from the carrier, first contact elements disposed on the second main face of the encapsulation layer, each one of the first contact elements being connected to one of the chip contact elements, and second contact elements disposed on the first main face of the encapsulation layer, each one of the second contact elements being connected to one of the chip contact elements.Type: ApplicationFiled: March 1, 2013Publication date: September 4, 2014Applicant: INFINEON TECHNOLOGIES AUSTRIA AGInventors: Khalil Hosseini, Thomas Wowra, Joachim Mahler, Ralf Wombacher
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Patent number: 8642389Abstract: The method comprises providing multiple chips attached to a first carrier, stretching the first carrier so that the distance between adjacent ones of the multiple chips is increased, and applying a laminate to the multiple chips and the stretched first carrier to form a first workpiece embedding the multiple chips, the first workpiece having a first main face facing the first carrier and a second main face opposite to the first main face.Type: GrantFiled: August 6, 2009Date of Patent: February 4, 2014Assignee: Infineon Technologies AGInventors: Thomas Wowra, Joachim Mahler, Manfred Mengel
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Publication number: 20130264721Abstract: The electronic module includes a first carrier and a first semiconductor chip arranged on the first carrier. A second semiconductor chip is arranged above the first semiconductor chip. A material layer adheres the second semiconductor chip to the first carrier and encapsulates the first semiconductor chip.Type: ApplicationFiled: April 5, 2012Publication date: October 10, 2013Applicant: INFINEON TECHNOLOGIES AGInventors: Stefan Landau, Joachim Mahler, Khalil Hosseini, Ivan Nikitin, Thomas Wowra, Lukas Ossowski
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Publication number: 20130134589Abstract: A chip-package includes a chip-carrier configured to carry a chip, the chip arranged over a chip-carrier side, wherein the chip-carrier side is configured in electrical connection with a chip back side; an insulation material including: a first insulation portion formed over a first chip lateral side; a second insulation portion formed over a second chip lateral side, wherein the first chip lateral side and the second chip lateral side each abuts opposite edges of the chip back side; and a third insulation portion formed over at least part of a chip front side, the chip front side including one or more electrical contacts formed within the chip front side; wherein at least part of the first insulation portion is arranged over the chip-carrier side and wherein the first insulation portion is configured to extend in a direction perpendicular to the first chip lateral side further than the chip-carrier.Type: ApplicationFiled: November 28, 2011Publication date: May 30, 2013Applicant: INFINEON TECHNOLOGIES AGInventors: Manfred Mengel, Thomas Wowra, Joachim Mahler, Khalil Hosseini
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Patent number: 8097959Abstract: A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. The integral array of second carriers is arranged over the first semiconductor chips.Type: GrantFiled: October 18, 2010Date of Patent: January 17, 2012Assignee: Infineon Technologies AGInventors: Stefan Landau, Joachim Mahler, Thomas Wowra
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Patent number: 7955954Abstract: A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. The integral array of second carriers is arranged over the first semiconductor chips.Type: GrantFiled: April 14, 2008Date of Patent: June 7, 2011Assignee: Infineon Technologies AGInventors: Stefan Landau, Joachim Mahler, Thomas Wowra
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Publication number: 20110031602Abstract: The method comprises providing multiple chips attached to a first carrier, stretching the first carrier so that the distance between adjacent ones of the multiple chips is increased, and applying a laminate to the multiple chips and the stretched first carrier to form a first workpiece embedding the multiple chips, the first workpiece having a first main face facing the first carrier and a second main face opposite to the first main face.Type: ApplicationFiled: August 6, 2009Publication date: February 10, 2011Applicant: Infineon Technologies AGInventors: Thomas Wowra, Joachim Mahler, Manfred Mengel
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Publication number: 20110031597Abstract: A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. The integral array of second carriers is arranged over the first semiconductor chips.Type: ApplicationFiled: October 18, 2010Publication date: February 10, 2011Applicant: INFINEON TECHNOLOGIES AGInventors: Stefan Landau, Joachim Mahler, Thomas Wowra
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Publication number: 20090256247Abstract: A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. The integral array of second carriers is arranged over the first semiconductor chips.Type: ApplicationFiled: April 14, 2008Publication date: October 15, 2009Applicant: INFINEON TECHNOLOGIES AGInventors: Stefan Landau, Joachim Mahler, Thomas Wowra
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Publication number: 20090189291Abstract: A multi-chip module and method is disclosed. One embodiment provides an electronic module having a first metal structure and a second metal structure. A first semiconductor chip is electrically connected with its back side to the first metal structure. A second semiconductor chip is arranged with its back side lying over the front side of the first semiconductor chip. The second metal structure includes multiple external contact elements attached over the front side of the second semiconductor chip. At least two of the multiple external contact elements are electrically connected to the front side of the second semiconductor chip.Type: ApplicationFiled: January 24, 2008Publication date: July 30, 2009Applicant: INFINEON TECHNOLOGIES AGInventors: Stefan Landau, Joachim Mahler, Thomas Wowra