Patents by Inventor Thomas Yuan
Thomas Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240078682Abstract: Training a multi-object tracking model includes: generating a plurality of training images based at least on scene generation information, each training image comprising a plurality of objects to be tracked; generating, for each training image, original simulated data based at least on the scene generation information, the original simulated data comprising tag data for a first object; locating, within the original simulated data, tag data for the first object, based on at least an anomaly alert (e.g., occlusion alert, proximity alert, motion alert) associated with the first object in the first training image; based at least on locating the tag data for the first object, modifying at least a portion of the tag data for the first object from the original simulated data, thereby generating preprocessed training data from the original simulated data; and training a multi-object tracking model with the preprocessed training data to produce a trained multi-object tracker.Type: ApplicationFiled: November 13, 2023Publication date: March 7, 2024Inventors: Ishani CHAKRABORTY, Jonathan C. HANZELKA, Lu YUAN, Pedro Urbina ESCOS, Thomas M. SOEMO
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Publication number: 20240073566Abstract: Advanced hologram techniques pre-calculate holograms to be displayed on an LCoS switch panel of a wavelength selective switch (WSS) module. The holograms are generated offline and are then stored on the WSS module for later retrieval. Each of the holograms is associated with a defined parameter, such as an attenuation level, and each of the holograms is configured to create a reconfigurable phase grating profile or pattern of the pixels of the LCoS switch panel. Each phase pattern selectively directs desired diffraction orders of optical channels from the LCoS switch panel for output to selected ports and selectively directs undesired diffraction orders away from the ports and at a desired attenuation level. During operation, the WSS module can retrieve the stored holograms. Interpolation can determine intermediate holograms between parameter values, and a ramp function can be added to the pattern to account for steering adjustments.Type: ApplicationFiled: August 25, 2022Publication date: February 29, 2024Inventors: Alan A. FENNEMA, Haijun Yuan, Wilfredo C. NANITA, Oswald CORREYA, Jack R KELLY, Thomas J. Schwartz
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Patent number: 11791442Abstract: An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.Type: GrantFiled: December 18, 2020Date of Patent: October 17, 2023Assignee: CreeLED, Inc.Inventors: Bernd Keller, Nicholas Medendorp, Jr., Thomas Yuan
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Publication number: 20210143302Abstract: An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.Type: ApplicationFiled: December 18, 2020Publication date: May 13, 2021Inventors: Bernd Keller, Nicholas Medendorp, JR., Thomas Yuan
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Patent number: 10043942Abstract: An embodiment of the invention comprises a first III-V semiconductor structure including a first light emitting layer disposed between a first n-type region and a first p-type region, and a second III-V semiconductor structure including a second light emitting layer disposed between a second n-type region and a second p-type region. A first contact is formed on a top surface of the first III-V semiconductor structure. A second contact is formed on a bottom surface of the second III-V semiconductor structure. A bonding structure is disposed between the first and second III-V semiconductor structures.Type: GrantFiled: October 14, 2014Date of Patent: August 7, 2018Assignee: Luminus Devices, Inc.Inventors: Ting Li, Thomas Yuan
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Patent number: 9793247Abstract: An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.Type: GrantFiled: June 5, 2008Date of Patent: October 17, 2017Assignees: CREE, INC., KONINKLIJKE PHILIPS ELECTRONICS NVInventors: Thomas Yuan, Bernd Keller, Eric Tarsa, James Ibbetson, Frederick Morgan, Kevin Dowling, Ihor Lys
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Patent number: 9484329Abstract: Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.Type: GrantFiled: December 2, 2009Date of Patent: November 1, 2016Assignee: CREE, INC.Inventors: Antony P. van de Ven, Gerald Negley, Thomas Yuan, Bernd Keller, Theodore Lowes
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Patent number: 9076940Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.Type: GrantFiled: August 20, 2013Date of Patent: July 7, 2015Assignee: Cree, Inc.Inventors: Thomas Yuan, Bernd Keller, James Ibbetson, Eric Tarsa, Gerald Negley
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Publication number: 20150137150Abstract: An embodiment of the invention comprises a first III-V semiconductor structure including a first light emitting layer disposed between a first n-type region and a first p-type region, and a second III-V semiconductor structure including a second light emitting layer disposed between a second n-type region and a second p-type region. A first contact is formed on a top surface of the first III-V semiconductor structure. A second contact is formed on a bottom surface of the second III-V semiconductor structure. A bonding structure is disposed between the first and second III-V semiconductor structures.Type: ApplicationFiled: October 14, 2014Publication date: May 21, 2015Inventors: Ting Li, Thomas Yuan
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Patent number: 8698171Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.Type: GrantFiled: June 5, 2012Date of Patent: April 15, 2014Assignee: Cree, Inc.Inventors: Thomas Yuan, Bernd Keller, James Ibbetson, Eric Tarsa, Gerald Negley
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Publication number: 20130341653Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.Type: ApplicationFiled: August 20, 2013Publication date: December 26, 2013Applicant: Cree, Inc.Inventors: THOMAS YUAN, Bernd Keller, James Ibbetson, Eric Tarsa, Gerald Negley
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Publication number: 20120241781Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.Type: ApplicationFiled: June 5, 2012Publication date: September 27, 2012Inventors: Thomas Yuan, Bernd Keller, James Ibbetson, Eric Tarsa, Gerald Negley
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Patent number: 8217412Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.Type: GrantFiled: September 16, 2010Date of Patent: July 10, 2012Assignee: Cree, Inc.Inventors: Thomas Yuan, Bernd Keller, James Ibbetson, Eric Tarsa, Gerald Negley
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Publication number: 20110012143Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.Type: ApplicationFiled: September 16, 2010Publication date: January 20, 2011Inventors: THOMAS YUAN, Bernd Keller, James Ibbetson, Eric Tarsa, Gerald Negley
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Patent number: 7821023Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.Type: GrantFiled: May 23, 2008Date of Patent: October 26, 2010Assignee: Cree, Inc.Inventors: Thomas Yuan, Bernd Keller, James Ibbetson, Eric Tarsa, Gerald Negley
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Publication number: 20100127283Abstract: Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.Type: ApplicationFiled: December 2, 2009Publication date: May 27, 2010Inventors: Antony P. van de Ven, Gerald Negley, Thomas Yuan, Bernd Keller, Ted Lowes
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Publication number: 20090050908Abstract: An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.Type: ApplicationFiled: June 5, 2008Publication date: February 26, 2009Inventors: Thomas Yuan, Bernd Keller, Eric Tarsa, James Ibbetson, Frederick Morgan, Kevin Dowling, Ihor Lys
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Publication number: 20090050907Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.Type: ApplicationFiled: May 23, 2008Publication date: February 26, 2009Inventors: Thomas Yuan, Bernd Keller, James Ibbetson, Eric Tarsa, Gerald Negley
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Patent number: 7157744Abstract: A package for a light emitting diode (LED) including an electrically insulating substrate layer, a non-conductive layer disposed on the electrically insulating substrate layer, and a reflector layer disposed on the non-conductive layer. The electrically insulating layer includes metallized portions for coupling a light emitting diode thereto.Type: GrantFiled: October 29, 2003Date of Patent: January 2, 2007Assignee: M/A-COM, Inc.Inventors: William J. Palmteer, Thomas Yuan, Richard Koba
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Publication number: 20050093116Abstract: A package for a light emitting diode (LED) including an electrically insulating substrate layer, a non-conductive layer disposed on the electrically insulating substrate layer, and a reflector layer disposed on the non-conductive layer. The electrically insulating layer includes metallized portions for coupling a light emitting diode thereto.Type: ApplicationFiled: October 29, 2003Publication date: May 5, 2005Applicant: M/A-COM, INC.Inventors: William Palmteer, Thomas Yuan, Richard Koba