Abstract: An optoelectronic semiconductor device is specified, comprising a multiplicity of radiation-emitting semiconductor chips (2), arranged in a matrix-like manner, wherein the semiconductor chips (2) are applied on a common carrier (1), at least one converter element (3) disposed downstream of at least one semiconductor chip (2) for converting electromagnetic radiation emitted by the semiconductor chip (2), at least one scattering element (4) situated downstream of each semiconductor chip (2) and serving for diffusely scattering electromagnetic radiation emitted by the semiconductor chip (2), wherein the scattering element (4) is in direct contact with the converter element (3).

Abstract: An optoelectronic component (1) is provided, having at least two connecters (2) for electrical contacting of the component (1), a housing body (3), in which the connecters (2) are embedded in places, a heat sink (4), which is connected to at least one connecter (2), wherein the housing body (3) is formed of a plastics material, the housing body (3) comprises an opening (30), in which the heat sink (4) is freely accessible in places, at least one optoelectronic semiconductor chip (5) is arranged in the opening (30) on the heat sink (4), and at least two of the connecters (2) each comprise a chip-end portion (2c), which faces the at least one optoelectronic semiconductor chip (5), wherein the chip-end portions (2c) of the at least two connecters (2) are arranged in a common plane.

Abstract: A headlight includes a plurality of luminescence diode emitters. At least one first group of the luminescence diode emitters is arranged in a matrix having at least two columns and at least two rows, wherein in the first group the electrical connections of a first connection type of the luminescence diode emitters of a column and the electrical connections of a second connection type of the luminescence diode emitters of a row are in each case electrically connected to one another. The electrical connections of the first connection type of different columns and the electrical connections of the second connection type of different rows of the matrix are electrically insulated from one another.

Abstract: An optoelectronic semiconductor component is provided, having a connection carrier (2), an optoelectronic semiconductor chip (1), which is arranged on a mounting face (22) of the connection carrier (2), and a radiation-transmissive body (3), which surrounds the semiconductor chip (1), wherein the radiation-transmissive body (3) contains a silicone, the radiation-transmissive body (3) comprises at least one side face (31) which extends at least in places at an angle ? of <90° to the mounting face (22) and the side face (3) is produced by a singulation process.

Abstract: An optoelectronic semiconductor device at least one radiation-emitting semiconductor chip (3); at least one converter element (4) disposed downstream of the semiconductor chip (3) and serving for converting electromagnetic radiation emitted by the semiconductor chip (3) during operation, wherein the converter element (4) emits colored light upon irradiation with ambient light; a means for diffusely scattering light (5), which is designed to scatter ambient light impinging on the device in a switched-off operating state of the device in such a way that a light exit area (62) of the device appears white.

Abstract: According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

Abstract: The application relates to a semiconductor component, a photo-reflective sensor, and also a method for producing a housing for a photo-reflective sensor, wherein the housing lower part is monolithic and has at least two cavities into which an emitter and a detector are introduced.

Abstract: An arrangement having at least two light-emitting semiconductor components (101, 111) arranged adjacent to one another has envelopes (102, 112) at least partly surrounding the at least two light-emitting semiconductor components in each case. The envelopes contain a converter substance, which partly or completely converts the wavelength range of the radiation emitted by the semiconductor components. At least one optical damping element (103) is arranged between the at least two light-emitting semiconductor components, which optically isolates the respective envelopes of the semiconductor components in order to reduce a coupling-in from at least one envelope (102) into at least one other of the envelopes (112), or from at least one semiconductor component (101) into the envelope (112) of at least one of the other semiconductor components (111).

Abstract: A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.

Abstract: An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.

Abstract: A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.

Abstract: An electronic component includes a semiconductor chip and a leadframe. The leadframe includes a metal coating pattern on its underside to facilitate the application of solder to the electronic component. The metal coating pattern includes wetting regions that are wettable with solder material and anti-wetting regions that are unwettable with solder material, and the electronic component includes solder deposits formed on the wetting regions on the underside of the component.

Abstract: A housing body for an optoelectronic component comprises a main surface having a first area region and a second area region. The first area region and the second area region form a step in the main surface. The first area region and the second area region adjoin one another by means of an outer edge. The second area region and the outer edge enclose the first area region.

Abstract: A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.

Abstract: A refrigeration appliance includes a thermally insulating housing and a thermally insulating door. At least one of the housing and the door define an evacuated interspace and have an evacuated thermal insulation filling the interspace, a shaped, thermoplastic, substantially gas and water vapor impermeable outer cladding, and a shaped, thermoplastic, substantially gas and water vapor impermeable inner cladding. The inner cladding and the outer cladding substantially surround the interspace in a vacuum-tight manner. The cladding can be formed from polyolefins, polyvinylidene chloride, perfluoroalkoxy polymers. For reducing gas permeability, the cladding can be formed from ethylene/vinyl alcohol copolymer, polyacrylonitrile, and polyamide. The claddings can have co-extruded and/or laminated layers. The cladding can include a sputtered metal layer and/or a plastic/metal composite foil. The cladding can be formed from a thermoformed or blow-molded plastic.

Abstract: A device for and method of packaging electronic components (1) using injection-molding. For this purpose, a multiplicity of components (1) are arranged in predetermined positions on a first side (2) of a leadframe (3). The leadframe (3) has interconnects (5) with contact terminal areas (6) for connecting to contact areas (7) of the electronic components (1) and contact vias (8) to external contacts on a second side (10) of the leadframe (3). In this case, the leadframe (3) includes a ceramic substrate (11) with a first side (2) having edge regions (12) configured with a ductile, annular metal layer (13).

Abstract: An electronic component includes a semiconductor chip and a leadframe. The leadframe includes a metal coating pattern on its underside to facilitate the application of solder to the electronic component. The metal coating pattern includes wetting regions that are wettable with solder material and anti-wetting regions that are unwettable with solder material, and the electronic component includes solder deposits formed on the wetting regions on the underside of the component.

Abstract: A method for producing a semiconductor component includes coating a substrate with a metalization. The metalization is structured in such a way that interconnects are formed at least in an encapsulation region. An encapsulation is applied in the encapsulation region around a previously applied chip. In order to provide sealing during the application of the encapsulation, either the interconnects are structured in such a way that they are interconnected, or a labyrinth structure is formed between the interconnects.

Abstract: The invention relates to a plastic package (14) with a plurality of semiconductor chips (3) and also a wiring board (11), on which the semiconductor chips (3) are arranged, and to an injection mold for producing the plastic package (14) and also to an electronic component which can be produced with the aid of the combination of the injection mold, wiring board (11) and plastic package (14). Furthermore, the invention relates to a method which, using the wiring board (11) according to the invention and the two-part injection mold, makes it possible to produce a plastic package (14) of this type with a plurality of semiconductor chips (3) for a plurality of electronic components.

Abstract: A circuit is described which has a semiconductor component surrounded by a plastic housing and with which contact can be made via conductor tracks. Between each dividing surface of the conductor tracks and an area of the plastic housing surrounding the relevant dividing surface, as viewed in plan view of the dividing surface, a spacing is provided in each case.