Abstract: The present invention provides a process for preparing a compound of formula [I] from a compound of formula [II] using an oxidizing agent and a catalyst, the process is carried out at a low temperature.

Abstract: The invention provides a process for preparing heterocyclic fluoroalkenyl sulfones and their thioether and sulfoxide precursors of the formula: Cl—R—S(O)n—(CH2)2—CF?CF2 (Formula I?) wherein R is a heterocyclic five-membered aromatic ring and n is 0, 1 or 2, comprising a step of dehalogenation of a compound of the formula: Cl—R—S(O)n—(CH2)2—CFX1—CF2X2 (Intermediate B), wherein X1 and X2 are independently halogen atoms, to remove said X1 and X2 atoms. Also included are novel intermediate compounds.

Abstract: A method is disclosed for preparing pyrazole derivative 3-bromo-5-methyl-1-H-pyrazole-N-2-chloropyridine (compound of Formula I) by reacting of a compound of Formula II with halogen substituted pyridine optionally in the presence of base and organic solvent or by decarboxylation of pyrazole carboxylic acid of Formula XI in the presence of acid. In addition, provided a method of preparation of synthetic precursors of Formula II, Formula IV, Formula V, Formula VI, Formula XI, and a method of preparing a compound of Formula VII comprising reacting a compound of Formula I with an oxidant optionally in the presence of a catalyst. Also disclosed a compound of Formula I as useful synthetic precursor for preparation of anthranilamide of Formula VIII.

Abstract: The present invention provides an improved process for preparing 5-chloro-2-[(3,4,4-trifluoro-3-buten-1-yl)thio]-thiazole comprising reacting 2-[(3,4,4-trifluoro-3-buten-1-yl)thio]-thiazole with N-chlorosuccinimide (NCS) in the presence of water, the improvement comprising performing the step of reacting the compound of formula (II) with NCS in the presence of a reduced amount of water. The present invention provides an improved process for preparing 5-chloro-2-[(3, 4,4-trifluoro-3-buten-1-yl)thio]-thiazole comprising reacting 2-[(3, 4,4-trifluoro-3-buten-1-yl)thio]-thiazole with N-chlorosuccinimide (NCS) in the presence of water, the improvement comprising performing the step of reacting the compound of formula (II) with an excess molar amount of NCS.

Abstract: The invention provides a process for preparing heterocyclic fluoroalkenyl sulfones and their thioether and sulfoxide precursors of the formula: Cl—R—S(O)n—(CH2)2—CF?CF2 (Formula I?) wherein R is a heterocyclic five-membered aromatic ring and n is 0, 1 or 2, comprising a step of dehalogenation of a compound of the formula: Cl—R—S(O)n—(CH2)2—CFX1—CF2X2 (Intermediate B), wherein X1 and X2 are independently halogen atoms, to remove said X1 and X2 atoms. Also included are novel intermediate compounds.

Abstract: The present invention provides a process for preparing a compound of formula [I] from a compound of formula [II] using an oxidizing agent and a catalyst, the process is carried out at a low temperature.

Abstract: The present invention provides an improved process for preparing 5-chloro-2-[(3,4,4-trifluoro-3-buten-1-yl)thio]-thiazole comprising reacting 2-[(3,4,4-trifluoro-3-buten-1-yl)thio]-thiazole with N-chlorosuccinimide (NCS) in the presence of water, the improvement comprising performing the step of reacting the compound of formula (II) with NCS in the presence of a reduced amount of water. The present invention provides an improved process for preparing 5-chloro-2-[(3, 4,4-trifluoro-3-buten-1-yl)thio]-thiazole comprising reacting 2-[(3, 4,4-trifluoro-3-buten-1-yl)thio]-thiazole with N-chlorosuccinimide (NCS) in the presence of water, the improvement comprising performing the step of reacting the compound of formula (II) with an excess molar amount of NCS.

Abstract: An apparatus for detecting a pre-aligning element at a wafer and a method for pre-aligning a wafer are disclosed. In an embodiment, the apparatus includes a sensor arrangement configured to illuminate subsequent edge portions of the wafer edge and to output a first and a second sensor signal, wherein the first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination; and an evaluation unit configured to evaluate the first sensor signal and to determine a first position information indicating a coarse position of the pre-aligning element, and, after having determined the first position information, to determine a second position information based on the second sensor signal and the first position information, wherein the second position information indicates a fine position of the pre-aligning element.

Abstract: An apparatus for detecting a pre-aligning element at a wafer and a method for pre-aligning a wafer are disclosed. In an embodiment, the apparatus includes a sensor arrangement configured to illuminate subsequent edge portions of the wafer edge and to output a first and a second sensor signal, wherein the first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination; and an evaluation unit configured to evaluate the first sensor signal and to determine a first position information indicating a coarse position of the pre-aligning element, and, after having determined the first position information, to determine a second position information based on the second sensor signal and the first position information, wherein the second position information indicates a fine position of the pre-aligning element.

Abstract: An apparatus detects a pre-aligning element at a wafer. The wafer has the pre-aligning element at a wafer edge. The apparatus includes a sensor arrangement and an evaluation unit. The sensor arrangement is configured to illuminate subsequent edge portions of the wafer edge, to receive transmitted fractions and reflected fractions of the illumination from the illuminated edge portions with an illumination sensor, and to output a first and a second sensor signal. The first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination. The evaluation unit is configured to evaluate the first sensor signal and to determine a first position information with respect to a coarse position of the pre-aligning element if the first sensor signal indicates that the transmitted fractions of the illumination has reached a predetermined threshold value.

Abstract: An apparatus detects a pre-aligning element at a wafer. The wafer has the pre-aligning element at a wafer edge. The apparatus includes a sensor arrangement and an evaluation unit. The sensor arrangement is configured to illuminate subsequent edge portions of the wafer edge, to receive transmitted fractions and reflected fractions of the illumination from the illuminated edge portions with an illumination sensor, and to output a first and a second sensor signal. The first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination. The evaluation unit is configured to evaluate the first sensor signal and to determine a first position information with respect to a coarse position of the pre-aligning element if the first sensor signal indicates that the transmitted fractions of the illumination has reached a predetermined threshold value.

Abstract: A method of manufacturing integrated circuits includes determining a process-induced displacement (e.g., a stress-induced displacement) between primary structures on a substrate and providing a photomask with mask features assigned to the primary structures. The distances between the mask features are set such that the process-induced displacement is compensated.

Abstract: The hydrodynamic effects—which occur during immersion lithography as a result of the movement of the semiconductor wafer—in a liquid preferably provided between the last lens surface of the projection system and the semiconductor wafer can be avoided by means of a movable illumination region for illuminating a cutout of a mask containing a structure to that can be imaged onto the semiconductor wafer. A scan movement of the mask and the semiconductor wafer can be either reduced or entirely avoided by means of a movement of the illumination region.

Abstract: The hydrodynamic effects—which occur during immersion lithography as a result of the movement of the semiconductor wafer—in a liquid preferably provided between the last lens surface of the projection system and the semiconductor wafer can be avoided by means of a movable illumination region for illuminating a cutout of a mask containing a structure to that can be imaged onto the semiconductor wafer. A scan movement of the mask and the semiconductor wafer can be either reduced or entirely avoided by means of a movement of the illumination region.

Abstract: In the fabrication of stacked vias, metal islands referred to as landing pads are introduced for the purpose of contact-connection between the vias that are arranged one above the other. The metal islands project laterally beyond the vias to a significant extent on account of the line shortening effect. The vias arranged in layers lying one above the other are laterally offset with respect to one another. The landing pad of the invention is configured as an interconnect running between the vias. On account of the line shortening effect, which is less critical for longer tracks, contact areas provided at the ends of the interconnect do not have to be chosen to be as large as the square contact areas of conventional metal islands and can therefore be accommodated to save more space on a circuit layout to be miniaturized. The shrink factor of such a semiconductor structure is increased.

Abstract: In the fabrication of stacked vias, metal islands referred to as landing pads are introduced for the purpose of contact-connection between the vias that are arranged one above the other. The metal islands project laterally beyond the vias to a significant extent on account of the line shortening effect. The vias arranged in layers lying one above the other are laterally offset with respect to one another. The landing pad of the invention is configured as an interconnect running between the vias. On account of the line shortening effect, which is less critical for longer tracks, contact areas provided at the ends of the interconnect do not have to be chosen to be as large as the square contact areas of conventional metal islands and can therefore be accommodated to save more space on a circuit layout to be miniaturized. The shrink factor of such a semiconductor structure is increased.

Abstract: In preparation for etch processing a semiconductor chip having areas of little or no pattern and areas that are heavily patterned, adding non-operative patterns to the areas having little or no pattern so that the overall pattern density is about the same across the chip.

Abstract: An electronic reprographic printing system that allows the sending of messages with a print job from remote user workstations to a central reprographic printing machine. The messages can be displayed on a User Interface, such as a video monitor, and additionally printed on a break page of the print job. Also disclosed is a system for sending messages that is capable of faulting a print job until the reprographic system operator acknowledges receipt of the message. The various messages can instruct the system operator to use a particular medium for the print job, for example, or instruct the system operator how to finish (bind, wrap, etc.) a print job.