Patents by Inventor Thompson Cheuk-Wai TANG

Thompson Cheuk-Wai TANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Storage device backplane with penetrating convection and computer framework
    Patent number: 9317078
    Abstract: A storage device backplane with penetrating convection and a computer framework with the storage device backplane are disclosed. The storage device backplane includes an integration board, an operation board and a heat dissipation unit. The integration board has a first surface for electrically connecting the storage device group. The operation board is superposed on and electrically connected to a second surface of the integration board and is provided that the operation board includes an electronic heating active element (EHAE) and an airflow hole set around the EHAE. The heat dissipation unit includes a heat absorb portion and multiple fins set on the heat absorb portion. The heat absorb portion makes a thermal contact with the EHAE. The fins laterally extend to cover the airflow hole. Airflow passages are formed between the fins corresponding to the airflow hole.
    Type: Grant
    Filed: April 4, 2014
    Date of Patent: April 19, 2016
    Assignee: SUPER MICRO COMPUTER INC.
    Inventors: Lawrence K. W. Lam, Ruei-Fu Weng, Thompson Cheuk-Wai Tang, Richard S. Chen
  • STORAGE DEVICE BACKPLANE WITH PENETRATING CONVECTION AND COMPUTER FRAMEWORK
    Publication number: 20150163964
    Abstract: A storage device backplane with penetrating convection and a computer framework with the storage device backplane are disclosed. The storage device backplane includes an integration board, an operation board and a heat dissipation unit. The integration board has a first surface for electrically connecting the storage device group. The operation board is superposed on and electrically connected to a second surface of the integration board and is provided that the operation board includes an electronic heating active element (EHAE) and an airflow hole set around the EHAE. The heat dissipation unit includes a heat absorb portion and multiple fins set on the heat absorb portion. The heat absorb portion makes a thermal contact with the EHAE. The fins laterally extend to cover the airflow hole. Airflow passages are formed between the fins corresponding to the airflow hole.
    Type: Application
    Filed: April 4, 2014
    Publication date: June 11, 2015
    Applicant: Super Micro Computer Inc.
    Inventors: Lawrence K.W. LAM, Ruei-Fu WENG, Thompson Cheuk-Wai TANG, Richard S. CHEN