Patents by Inventor Thong B. Luong

Thong B. Luong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6039859
    Abstract: The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic--lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.
    Type: Grant
    Filed: May 20, 1998
    Date of Patent: March 21, 2000
    Assignee: Shipley Company, L.L.C.
    Inventors: Wade Sonnenberg, Patrick J. Houle, Thong B. Luong, James G. Shelnut, Gordon Fisher
  • Patent number: 6017967
    Abstract: The invention relates to a metal sulfide dispersion used for electroplating nonconductors such as substrates used for the formation of a printed circuit board. A printed circuit board made using the dispersion could have metallized through-holes comprising electrodeposited copper on the walls of the holes with an adsorbed layer of metal sulfide particles between the circuit board base material and the copper on the walls of the through-holes. The metal sulfide is characterized by spherical particles having a mean diameter of less than 100 nanometers and a particle size distribution where less than 10 percent of the particles within the dispersion have a diameter twice that of the mean diameter of all particles within the dispersion.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: January 25, 2000
    Assignee: Shipley Company, L.L.C.
    Inventors: Egon Matijevic, Matthias Schultz, Wade Sonnenberg, John J. Bladon, Patrick J. Houle, Thong B. Luong
  • Patent number: 5800739
    Abstract: The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic-lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.
    Type: Grant
    Filed: April 11, 1996
    Date of Patent: September 1, 1998
    Assignee: Shipley Company, L.L.C.
    Inventors: Wade Sonnenberg, Patrick J. Houle, Thong B. Luong, James G. Shelnut, Gordon Fisher
  • Patent number: 5667662
    Abstract: A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer containing a polymeric stabilizer having repeating alkylene oxide groups and a hydrophilic--lipophilic balance of at least 10.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: September 16, 1997
    Assignee: Shipley Company, L.L.C.
    Inventors: Wade Sonnenberg, Patrick J. Houle, Thong B. Luong, James G. Shelnut, Gordon Fisher