Abstract: A vital signs monitoring patch with integrated display (VSM) includes a user access layer for accessing a display section and a first printed silver-silver chloride (Ag—AgCl) electrode. A polyethylene foam layer including battery and plunger cut-outs. A printed circuit board assembly (PCBA) layer including vitals sign monitoring sensors and the battery and connected to the first and second printed Ag—AgCl electrodes. The polyethylene foam layer bonded to the user access layer and the PCBA layer. A sensor layer including reflection mode oximetry components and the second printed Ag—AgCl electrode. A hydrogel conductive adhesive to interact between a user skin and the second printed Ag—AgCl electrode. A medical tape layer bonded to the user skin and the sensor layer. A plunger connected to the PCBA layer and configured to power on the VSM, where user access of the first printed Ag—AgCl electrode completes a circuit with the second printed Ag—AgCl electrode.

Abstract: A vital signs monitoring ring with integrated display includes a ring housing, the ring housing comprising at least two windows and a printed circuit board assembly (PCBA) layer configured to be attached to the ring housing. The PCBA layer includes a display section, a sensor section, a transmission mode oximetry measurement section configured to be in alignment with the at least two windows, a power supply, and a switch configured to power on the vital signs monitoring ring with integrated display via the power supply. The display section is configured to display physiological and action parameters associated with a user by sensing the physiological and action signals from a digit of user wearing the vital signs monitoring ring with integrated display using at least the sensor section and the transmission mode oximetry measurement section.

Abstract: A vital signs monitoring ring with integrated display includes a ring housing, the ring housing comprising at least two windows and a printed circuit board assembly (PCBA) layer configured to be attached to the ring housing. The PCBA layer includes a display section, a sensor section, a transmission mode oximetry measurement section configured to be in alignment with the at least two windows, a power supply, and a switch configured to power on the vital signs monitoring ring with integrated display via the power supply. The display section is configured to display physiological and action parameters associated with a user by sensing the physiological and action signals from a digit of user wearing the vital signs monitoring ring with integrated display using at least the sensor section and the transmission mode oximetry measurement section.

Abstract: A vital signs monitoring patch with integrated display (VSM) includes a user access layer for accessing a display section and a first printed silver-silver chloride (Ag—AgCl) electrode. A polyethylene foam layer including battery and plunger cut-outs. A printed circuit board assembly (PCBA) layer including vitals sign monitoring sensors and the battery and connected to the first and second printed Ag—AgCl electrodes. The polyethylene foam layer bonded to the user access layer and the PCBA layer. A sensor layer including reflection mode oximetry components and the second printed Ag—AgCl electrode. A hydrogel conductive adhesive to interact between a user skin and the second printed Ag—AgCl electrode. A medical tape layer bonded to the user skin and the sensor layer. A plunger connected to the PCBA layer and configured to power on the VSM, where user access of the first printed Ag—AgCl electrode completes a circuit with the second printed Ag—AgCl electrode.

Abstract: A vital signs monitoring ring with integrated display includes a ring housing, the ring housing comprising at least two windows and a printed circuit board assembly (PCBA) layer configured to be attached to the ring housing. The PCBA layer includes a display section, a sensor section, a transmission mode oximetry measurement section configured to be in alignment with the at least two windows, a power supply, and a switch configured to power on the vital signs monitoring ring with integrated display via the power supply. The display section is configured to display physiological and action parameters associated with a user by sensing the physiological and action signals from a digit of user wearing the vital signs monitoring ring with integrated display using at least the sensor section and the transmission mode oximetry measurement section.

Abstract: A vital signs monitoring patch with integrated display (VSM) includes a user access layer for accessing a display section and a first printed silver-silver chloride (Ag—AgCl) electrode. A polyethylene foam layer including battery and plunger cut-outs. A printed circuit board assembly (PCBA) layer including vitals sign monitoring sensors and the battery and connected to the first and second printed Ag—AgCl electrodes. The polyethylene foam layer bonded to the user access layer and the PCBA layer. A sensor layer including reflection mode oximetry components and the second printed Ag—AgCl electrode. A hydrogel conductive adhesive to interact between a user skin and the second printed Ag—AgCl electrode. A medical tape layer bonded to the user skin and the sensor layer. A plunger connected to the PCBA layer and configured to power on the VSM, where user access of the first printed Ag—AgCl electrode completes a circuit with the second printed Ag—AgCl electrode.

Abstract: A vital signs monitoring ring with integrated display includes a ring housing, the ring housing comprising at least two windows and a printed circuit board assembly (PCBA) layer configured to be attached to the ring housing. The PCBA layer includes a display section, a sensor section, a transmission mode oximetry measurement section configured to be in alignment with the at least two windows, a power supply, and a switch configured to power on the vital signs monitoring ring with integrated display via the power supply. The display section is configured to display physiological and action parameters associated with a user by sensing the physiological and action signals from a digit of user wearing the vital signs monitoring ring with integrated display using at least the sensor section and the transmission mode oximetry measurement section.

Abstract: A vital signs monitoring patch with integrated display (VSM) includes a user access layer for accessing a display section and a first printed silver-silver chloride (Ag—AgCl) electrode. A polyethylene foam layer including battery and plunger cut-outs. A printed circuit board assembly (PCBA) layer including vitals sign monitoring sensors and the battery and connected to the first and second printed Ag—AgCl electrodes. The polyethylene foam layer bonded to the user access layer and the PCBA layer. A sensor layer including reflection mode oximetry components and the second printed Ag—AgCl electrode. A hydrogel conductive adhesive to interact between a user skin and the second printed Ag—AgCl electrode. A medical tape layer bonded to the user skin and the sensor layer. A plunger connected to the PCBA layer and configured to power on the VSM, where user access of the first printed Ag—AgCl electrode completes a circuit with the second printed Ag—AgCl electrode.

Abstract: A vital signs monitoring patch with integrated display (VSM) includes a user access layer for accessing a display section and a first printed silver-silver chloride (Ag—AgCl) electrode. A polyethylene foam layer including battery and plunger cut-outs. A printed circuit board assembly (PCBA) layer including vitals sign monitoring sensors and the battery and connected to the first and second printed Ag—AgCl electrodes. The polyethylene foam layer bonded to the user access layer and the PCBA layer. A sensor layer including reflection mode oximetry components and the second printed Ag—AgCl electrode. A hydrogel conductive adhesive to interact between a user skin and the second printed Ag—AgCl electrode. A medical tape layer bonded to the user skin and the sensor layer. A plunger connected to the PCBA layer and configured to power on the VSM, where user access of the first printed Ag—AgCl electrode completes a circuit with the second printed Ag—AgCl electrode.

Abstract: A high efficiency thermal management system for solid state lighting devices includes an LED heat sink housing formed by a flat bottom wall and a sidewall mounted about its periphery that extends radially outwardly so that the heat sink housing has a frusto-conical shape. Heat-dissipating pin-shaped fins of differing lengths depend from the exterior of the angled wall and from the bottom of the flat bottom wall. The radially inward side of the angled wall has a highly light-reflective surface for collimating light. The base of the device provides a housing for driver electronics. The heat sink housing, the pin-shaped fins, and the base are collectively contoured so that the system has the overall size and shape of a type A light bulb.

Abstract: A solid state lighting device includes a first group of semiconductor light emitting devices that produces a yellowish white light, a second group of semiconductor light emitting devices that includes at least one light emitting device that produces a reddish orange light, and a third group of semiconductor light emitting devices that includes at least one wavelength down-converted white light device. A combination of the second and third groups produces a sub-mixture of reddish warm white light. A combination of the first, second and third groups produces a mixture of warm white light with a correlated color temperature between 2700k to 3500K and a color rendering index higher than 85.

Abstract: A semiconductor lighting device includes a semiconductor light emitter packaged on a reflective substrate to emit a first light and a remote wavelength conversion layer on a back-transferred light path to convert the back-transferred first light into a forward second light. A filter is disposed on a light emitting forward path with a space to the semiconductor light emitter to reflect back at least a portion of the first light. A diffusive member may be positioned outside of the filter to diffuse the forward passing light before it exits from the semiconductor lighting device. As a second aspect of this invention, a solid state lighting device includes a short wavelength semiconductor emitter; a long wavelength semiconductor emitter with wavelength in reddish orange range; a filter on a light emitting forward path to reflect back a portion of short wavelength first light; and a wavelength conversion component on a back-transferred light path.

Abstract: A lighting apparatus includes at least one LED and a chromaticity tuning cavity adapted to capture light from the LED. The chromaticity tuning cavity is defined by a light translucent window and a plurality of backscattering light recycling surfaces. The light translucent window is adapted to backscatter at least a portion of the LED light. A preselected chromaticity tuning member is positioned within the chromaticity tuning cavity. It is selected from a group of chromaticity tuning members adapted to tune the chromaticity of various lighting apparatuses within one quadrangle on a chromaticity diagram. At least a portion of the LED light, having been backscattered and tuned by the preselected tuning member, passes through the light translucent window as warm white extraction light.

Abstract: A solid state lighting device includes a light mixing cavity enclosed by a diffusive output window, heat sink walls, and a light-redirection member. A plurality of circumferentially spaced apart light emitters is secured to an interior surface of the heat sink walls. The diffusive output window and light-redirection member are therefore disposed at opposite ends of the light mixing cavity. A semiconductor lighting device driver is disposed external to the light mixing cavity in electrical communication with the light emitters. Light emitted by the plurality of light emitters is reflected from the light-redirection member and from the heat sink walls prior to exiting the light mixing cavity through the diffusive output window.

Abstract: A high luminous flux warm white solid state lighting device with a high color rendering is disclosed. The device comprising two groups of semiconductor light emitting components to emit and excite four narrow-band spectrums of lights at high luminous efficacy, wherein the semiconductor light emitting components are directly mounted on a thermal effective dissipation member; a mixing cavity for blending the multi-spectrum of lights; a back-transferred light recycling member deposited on top of an LED driver and around the semiconductor light emitters; and a diffusive member to diffuse the mixture of output light from the solid state lighting device. The solid state lighting device produces a warm white light with luminous efficacy at least 80 lumens per watt and a color rendering index at least 85 for any lighting application.

Abstract: A high luminous flux warm white solid state lighting device with a high color rendering is disclosed. The device comprising two groups of semiconductor light emitting components to emit and excite four narrow-band spectrums of lights at high luminous efficacy, wherein the semiconductor light emitting components are directly mounted on a thermal effective dissipation member; a mixing cavity for blending the multi-spectrum of lights; a back-transferred light recycling member deposited on top of an LED driver and around the semiconductor light emitters; and a diffusive member to diffuse the mixture of output light from the solid state lighting device. The solid state lighting device produces a warm white light with luminous efficacy at least 80 lumens per watt and a color rendering index at least 85 for any lighting application.

Abstract: A high color rendering index (CRI) white light emitting device from a short wavelength semiconductor die is encapsulated with nanoparticle-loaded resin. Trichromatic wavelength conversion micro-particles are dispersed layer by layer in a converting sequence from a long emission spectrum to a short emission spectrum. The refractive index of wavelength conversion micro-particles matches that of the nanoparticle-loaded encapsulants.

Abstract: A high luminous flux warm white solid state lighting device with a high color rendering is disclosed. The device comprising two groups of semiconductor light emitting components to emit and excite four narrow-band spectrums of lights at high luminous efficacy, wherein the semiconductor light emitting components are directly mounted on a thermal effective dissipation member; a mixing cavity for blending the multi-spectrum of lights; a back-transferred light recycling member deposited on top of an LED driver and around the semiconductor light emitters; and a diffusive member to diffuse the mixture of output light from the solid state lighting device. The solid state lighting device produces a warm white light with luminous efficacy at least 80 lumens per watt and a color rendering index at least 85 for any lighting application.

Abstract: A semiconductor lighting device includes a semiconductor light emitter packaged on a reflective substrate to emit a first light and a remote wavelength conversion layer on a back-transferred light path to convert the back-transferred first light into a forward second light. A filter is disposed on a light emitting forward path with a space to the semiconductor light emitter to reflect back at least a portion of the first light. A diffusive member may be positioned outside of the filter to diffuse the forward passing light before it exits from the semiconductor lighting device. As a second aspect of this invention, a solid state lighting device includes a short wavelength semiconductor emitter; a long wavelength semiconductor emitter with wavelength in reddish orange range; a filter on a light emitting forward path to reflect back a portion of short wavelength first light; and a wavelength conversion component on a back-transferred light path.

Abstract: The invention discloses a high efficiency incandescent and Compact Fluorescent (CFL) bulb replacement LED lamp having a good color reproduction. The LED light bulb includes two groups of semiconductor light emitters and a luminescent material to emit four different spectrums of light. The two groups of semiconductor light emitters are enclosed around an interior wall of the light bulb housing, which has a plurality of fins at an exterior surface for effective heat dissipation. A high reflective member having a dome shape in the center is disposed under the two groups of semiconductor light emitters to redirect the emission and excitation lights from the two groups of semiconductor light emitters and recycle the backscattered light for multi-spectrum light mixing. The LED-light bulb further includes a single power line connecting to the two groups of semiconductor light emitters and a high efficiency electrical AC/DC conversion and control device.