Abstract: The present disclosure relates to an integrated circuit module with electromagnetic shielding. The integrated circuit module includes a die with an input/output (I/O) port at a bottom surface of the die, a mold compound partially encapsulating the die and leaving the bottom surface of the die exposed, a first dielectric pattern over the bottom surface of the die, a redistribution structure over the first dielectric pattern, and a shielding structure. The I/O port at the bottom surface of the die is exposed through the first dielectric pattern. The redistribution structure includes a shield connected element that is coupled to the I/O port and extends laterally beyond the die. The shielding structure resides over a top surface of the mold compound, extends along side surfaces of the mold compound, and is in contact with the shield connected element. Herein, the shielding structure does not extend vertically beyond the shield connected element.

Abstract: A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.

Abstract: The present disclosure relates to an integrated circuit module with electromagnetic shielding. The integrated circuit module includes a die with an input/output (I/O) port at a bottom surface of the die, a mold compound partially encapsulating the die and leaving the bottom surface of the die exposed, a first dielectric pattern over the bottom surface of the die, a redistribution structure over the first dielectric pattern, and a shielding structure. The I/O port at the bottom surface of the die is exposed through the first dielectric pattern. The redistribution structure includes a shield connected element that is coupled to the I/O port and extends laterally beyond the die. The shielding structure resides over a top surface of the mold compound, extends along side surfaces of the mold compound, and is in contact with the shield connected element. Herein, the shielding structure does not extend vertically beyond the shield connected element.

Abstract: The present disclosure integrates electromagnetic shielding into a wafer level fan-out packaging process. First, a mold wafer having multiple modules is provided. Each module includes a die with an I/O port and is surrounded by an inter-module area. A redistribution structure that includes a shield connected element coupled to the I/O port of each module is formed over a bottom surface of the mold wafer. The shield connected element extends laterally from the I/O port into the inter-module area for each module. Next, the mold wafer is sub-diced at each inter-module area to create a cavity. A portion of the shield connected element is then exposed through the bottom of each cavity. A shielding structure is formed over a top surface of the mold wafer and exposed faces of each cavity. The shielding structure is in contact with the shield connected element.

Abstract: The present disclosure integrates electromagnetic shielding into a wafer level fan-out packaging process. First, a mold wafer having multiple modules is provided. Each module includes a die with an I/O port and is surrounded by an inter-module area. A redistribution structure that includes a shield connected element coupled to the I/O port of each module is formed over a bottom surface of the mold wafer. The shield connected element extends laterally from the I/O port into the inter-module area for each module. Next, the mold wafer is sub-diced at each inter-module area to create a cavity. A portion of the shield connected element is then exposed through the bottom of each cavity. A shielding structure is formed over a top surface of the mold wafer and exposed faces of each cavity. The shielding structure is in contact with the shield connected element.

Abstract: In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract: A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.

Abstract: In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract: A light fixture including a turbine generator having one or more vertical-axis wind turbines (VAWTs) for generating energy and a plate located above and/or below each turbine for focusing and converging the wind inwardly. The plate is aerodynamically-designed to converge the wind onto the turbine and provide a strong wind current. The turbine generator is incorporated into a light fixture to provide self-sustaining light energy. Solar panels may be provided in conjunction with the turbine generator to provide an additional source of energy and a controller is included to manage the flow of electricity and ensure that the light fixture is powered during periods of darkness.

Abstract: A turbine generator having one or more wind turbines for generating energy and a series of plates located above and below each turbine for focusing and converging the wind inwardly. The plates are aerodynamically-designed to converge the wind onto the turbine and provide a strong wind current. The turbine generator is incorporated into a light fixture to provide self-sustaining light energy. Solar panels may be provided in conjunction with the turbine generator to provide an additional source of energy.

Abstract: A light fixture including a turbine generator having one or more vertical-axis wind turbines (VAWTs) for generating energy and a plate located above and/or below each turbine for focusing and converging the wind inwardly. The plate is aerodynamically-designed to converge the wind onto the turbine and provide a strong wind current. The turbine generator is incorporated into a light fixture to provide self-sustaining light energy. Solar panels may be provided in conjunction with the turbine generator to provide an additional source of energy and a controller is included to manage the flow of electricity and ensure that the light fixture is powered during periods of darkness.

Abstract: A turbine generator having one or more wind turbines for generating energy and a series of plates located above and below each turbine for focusing and converging the wind inwardly. The plates are aerodynamically-designed to converge the wind onto the turbine and provide a strong wind current. The turbine generator is incorporated into a light fixture to provide self-sustaining light energy. Solar panels may be provided in conjunction with the turbine generator to provide an additional source of energy.

Abstract: A cross-flow propulsion mechanism for use in providing propulsion to an aircraft, includes a housing defining an inlet, a rotor compartment, and an outlet. The inlet is adapted to receive an inflow of air along a first longitudinal axis. The rotor is mounted within the rotor compartment and adapted to receive the airflow introduced into said housing through the inlet and rotate about a second longitudinal axis that is substantially perpendicular to the first longitudinal axis. The outlet is adapted to receive the airflow processed through the rotor and exhaust air along a third longitudinal axis that is substantially parallel to the first longitudinal axis. The propulsion mechanism can be applied in a personal aircraft, an STOL aircraft, and a hybrid automobile and aircraft.