Patents by Inventor Thongchai Hongsmatip

Thongchai Hongsmatip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compact slotted-waveguide spatial power divider/combiner/amplifier
    Patent number: 6828875
    Abstract: A spatial power divider/combiner that comprises: a housing containing a first channel forming three sides of a rectangular input waveguide and a second channel forming three sides of a rectangular output waveguide; a board coupled to the housing, wherein the underside of the board forms the fourth side of the input and output waveguides; a series of slots etched on the underside of the board located in the input waveguide to divide an input signal; a series of slots etched on the underside of the board located in the output waveguide to recombine the divided signal; and a series of microstrip lines printed on the top side of the board to couple the input waveguide and the output waveguide. Additionally, the divider/combiner can comprise a series of active devices, such as MMIC power amplifier, to provide a spatial power amplifier.
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: December 7, 2004
    Assignee: MIA-Com, Inc.
    Inventors: Eswarappa Channabasappa, Thongchai Hongsmatip, Noyan Kinayman, Richard Alan Anderson, Bernhard A. Ziegner
  • Compact slotted-waveguide spatial power divider/combiner/amplifier
    Publication number: 20040108903
    Abstract: A spatial power divider/combiner that comprises: a housing containing a first channel forming three sides of a rectangular input waveguide and a second channel forming three sides of a rectangular output waveguide; a board coupled to the housing, wherein the underside of the board forms the fourth side of the input and output waveguides; a series of slots etched on the underside of the board located in the input waveguide to divide an input signal; a series of slots etched on the underside of the board located in the output waveguide to recombine the divided signal; and a series of microstrip lines printed on the top side of the board to couple the input waveguide and the output waveguide. Additionally, the divider/combiner can comprise a series of active devices, such as MMIC power amplifier, to provide a spatial power amplifier.
    Type: Application
    Filed: December 9, 2002
    Publication date: June 10, 2004
    Inventors: Eswarappa Channabasappa, Thongchai Hongsmatip, Noyan Kinayman, Richard Alan Anderson, Bernhard A. Ziegner