Patents by Inventor Thoon Khin Chang

Thoon Khin Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making solder pad
    Patent number: 7566648
    Abstract: A method of making a solder pad includes providing a substrate having a metal layer formed on it, and applying a photo resist to the metal layer. The photo resist is patterned. A first etching operation is performed on the metal layer to form voids in the metal layer. A second etching operation is performed on the metal layer to form the solder pad. A solder mask is formed on the substrate and a portion of the solder pad.
    Type: Grant
    Filed: April 22, 2007
    Date of Patent: July 28, 2009
    Assignee: Freescale Semiconductor Inc.
    Inventors: Heng Keong Yip, Thoon Khin Chang, Chee Seng Foong
  • Method for forming reinforced interconnects on a substrate
    Patent number: 7494924
    Abstract: A method for forming reinforced interconnects or bumps on a substrate includes first forming a support structure on the substrate. A substantially filled capsule is then formed around the support structure to form an interconnect. The interconnect can reach a height of up to 300 microns.
    Type: Grant
    Filed: March 6, 2006
    Date of Patent: February 24, 2009
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Hei Ming Shiu, On Lok Chau, Gor Amie Lai, Heng Keong Yip, Thoon Khin Chang, Lan Chu Tan
  • METHOD OF MAKING SOLDER PAD
    Publication number: 20080258297
    Abstract: A method of making a solder pad includes providing a substrate having a metal layer formed on it, and applying a photo resist to the metal layer. The photo resist is patterned. A first etching operation is performed on the metal layer to form voids in the metal layer. A second etching operation is performed on the metal layer to form the solder pad. A solder mask is formed on the substrate and a portion of the solder pad.
    Type: Application
    Filed: April 22, 2007
    Publication date: October 23, 2008
    Inventors: Heng Keong YIP, Thoon Khin Chang, Chee Seng Foong