Abstract: Chip carrier with integrated functions such as antennas, EMI shields, and heat sinks are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: A system and method using thermal feedback to cooperatively vary a voltage and frequency of a circuit to control heating while maintaining synchronization. Preferably, on-chip thermal sensors are used for feedback.

Abstract: A system and method using thermal feedback to cooperatively vary a voltage and frequency of a circuit to control heating while maintaining synchronization. Preferably, on-chip thermal sensors are used for feedback.

Abstract: A system and method for modulating the switching factor of a circuit to control heating and which does not require modulation of the circuit's clock frequency. The switching factor refers to the fact that due to gating requirements, latency and data transfer characteristics, the rate at which a circuit's inputs are addressed is some fraction of the circuit clock frequency. Application can be made to many existing systems which incorporate single or multiple VLSI circuits such as superscalar microprocessors, parallel processors, DSPs, microcontrollers and MPEG decoders.

Abstract: A synchronizer and phase aligning method that provide signal smoothing and filtering functions as well as slip-cycle compensation, and allow for multichannel digital phase alignment, bus deskewing, integration of multiple transceivers within a single semiconductor chip, etc. A delay line produces a plurality of delayed input replicas of an input signal. A clock phase adjuster produces a sampling clock signal from a reference clock signal. The sampling clock signal may be phase adjusted to be offset from the input signal. After certain smoothing and filtering functions, selection logic detects a phase relationship between the sampling clock signal and the input replicas and identifies a closely synchronized signal for output. Using this identified replica signal, slip-cycle compensation and retiming logic outputs a compensated data output signal synchronized with the reference clock signal. Also, an integrated multiple transceiver produced using the phase alignment technique is presented.