Patents by Inventor Thor Lee LEE

Thor Lee LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for thin multi chip stack package with film on wire and copper wire
    Patent number: 8680686
    Abstract: A system and method for a thin multi chip stack package with film on wire and copper wire. The package comprises a substrate and a first die overlying the substrate. Copper wires electrically connect the first die to the substrate. A film overlies the first die and a portion of the copper wires. In addition, the film adheres a second die to the first die. The film also electrically insulates the copper wires from the second die.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: March 25, 2014
    Assignee: Spansion LLC
    Inventors: Lai Nguk Chin, Foong Yue Ho, Wong Kwet Nam, Thor Lee Lee, Sally Foong, Kevin Guan
  • METHOD AND SYSTEM FOR THIN MULTI CHIP STACK PACKAGE WITH FILM ON WIRE AND COPPER WIRE
    Publication number: 20110316158
    Abstract: A system and method for a thin multi chip stack package with film on wire and copper wire. The package comprises a substrate and a first die overlying the substrate. Copper wires electrically connect the first die to the substrate. A film overlies the first die and a portion of the copper wires. In addition, the film adheres a second die to the first die. The film also electrically insulates the copper wires from the second die.
    Type: Application
    Filed: June 29, 2010
    Publication date: December 29, 2011
    Inventors: Lai Nguk CHIN, Foong Yue HO, Wong Kwet NAM, Thor Lee LEE, Sally FOONG, Kevin GUAN