Abstract: The invention provides methods for making porous devices from substantially monodisperse populations of substantially spherical particles of polyarylketone polymers or of thio-analogues of such polymers, of selected sizes. The porous devices allow greater control of porosity than previously available porous devices. In some embodiments, the porous devices are frits, filters, membranes or monoliths.

Abstract: A filter includes an inlet side, an outlet side, and a body. The body includes a first substrate that includes an array of inlet holes passing through the first substrate, and a second substrate that includes an array of outlet holes passing through the second substrate. The body further includes an intermediate region that includes a plurality of channels extending along a plane that is transverse or at an angle to a main axis of the filter. Each channel communicates directly or indirectly with at least one of the inlet holes and at least one of the outlet holes. The filter provides a plurality of fluid flow paths through the body from the inlet side to the outlet side.

Abstract: A filter includes an inlet side, an outlet side, and a body. The body includes a first substrate that includes an array of inlet holes passing through the first substrate, and a second substrate that includes an array of outlet holes passing through the second substrate. The body further includes an intermediate region that includes a plurality of channels extending along a plane that is transverse or at an angle to a main axis of the filter. Each channel communicates directly or indirectly with at least one of the inlet holes and at least one of the outlet holes. The filter provides a plurality of fluid flow paths through the body from the inlet side to the outlet side.

Abstract: The invention provides a method of rapidly machining multiple, often similar or nearly identical, features using a LASER machining system. During LASER machining, light of a wavelength and intensity that will modify the workpiece to be machined is directed at the workpiece and interacts to produce the desired change. If several features are to be machined, the processing speed can be increased by operating on a multiplicity of features at once. In one embodiment of the invention, this is achieved by separating the LASER beam into multiple beams and machining the desired features simultaneously.

Abstract: Method for fabricating and inspecting small holes in a material are disclosed. The method includes directing light onto the material and through the holes formed in the material, and then collecting the light passing through the holes in the material onto a detector. The methods further include analyzing the light for properties of the holes, and modifying the process based these detected properties.

Abstract: The invention provides a method of rapidly machining multiple, often similar or nearly identical, features using a LASER machining system. During LASER machining, light of a wavelength and intensity that will modify the workpiece to be machined is directed at the workpiece and interacts to produce the desired change. If several features are to be machined, the processing speed can be increased by operating on a multiplicity of features at once. In one embodiment of the invention, this is achieved by separating the LASER beam into multiple beams and machining the desired features simultaneously.

Abstract: Method for fabricating and inspecting small holes in a material are disclosed. The method includes directing light onto the material and through the holes formed in the material, and then collecting the light passing through the holes in the material onto a detector. The methods further include analyzing the light for properties of the holes, and modifying the process based these detected properties.

Abstract: Method for fabricating and inspecting small holes in a material are disclosed. The method includes directing light onto the material and through the holes formed in the material, and then collecting the light passing through the holes in the material onto a detector. The methods further include analyzing the light for properties of the holes, and modifying the process based these detected properties.