Patents by Inventor Thornton W. Sargent, IV

Thornton W. Sargent, IV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7141993
    Abstract: An apparatus and method for coupling a test head and probe card in an IC testing system incorporating patterned divider elements (24) disposed between rows of signal conductors (22) to provide matching characteristic impedance values along each row of signal conductors. The divider elements have a patterned conductive layer formed thereon that is electrically connected to ground, and a method for determining a useful pattern is provided. Test dividers (24) fabricated with openings of various size and shape are used to construct transmission lines. The impedance of these lines is measured, and the results are used to interpolate an appropriate opening size and shape to achieve a desired transmission line impedance.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: November 28, 2006
    Assignee: inTEST Corporation
    Inventors: Douglas W. Smith, Thornton W. Sargent, IV, Stuart F. Daniels
  • Publication number: 20040150490
    Abstract: An apparatus and method for coupling a test head and probe card in an IC testing system incorporating patterned divider elements disposed between rows of signal conductors to provide matching characteristic impedance values along each row of signal conductors. The divider elements have a patterned conductive layer formed thereon that is electrically connected to ground, and a method for determining a useful pattern is provided.
    Type: Application
    Filed: December 17, 2003
    Publication date: August 5, 2004
    Inventors: Douglas W. Smith, Thornton W. Sargent IV, Stuart F. Daniels
  • Patent number: 6594416
    Abstract: A bi-directional interface for transmitting signals between a circuit tester and a connection point proximate to a circuit to be tested includes a first and a second optical fiber link, a first directional gate for coupling both the input end of the first link and the output end of the second link to one endpoint of the interface and a second directional gate for coupling both the input end of the second link and the output end of the first link to the other endpoint of the interface. An optical fiber link includes an optical fiber, a light source, and a photodetector.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: July 15, 2003
    Assignee: inTEST IP Corp.
    Inventors: Thornton W. Sargent, IV, Douglas W. Smith
  • Patent number: 6404949
    Abstract: A bi-directional interface for transmitting signals between a circuit tester and a connection point proximate to a circuit to be tested includes a first and a second optical fiber link, a first directional gate for coupling both the input end of the first link and the output end of the second link to one endpoint of the interface and a second directional gate for coupling both the input end of the second link and the output end of the first link to the other endpoint of the interface. An optical fiber link for transmitting a signal between a circuit tester and a connection point proximate to a circuit to be tested includes an optical fiber for transmitting the signal, a light source electrically coupled to the link input and optically coupled to the input of the fiber, and a photodetector optically coupled to the fiber output and electrically coupled to the link output.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: June 11, 2002
    Assignee: inTEST IP Corporation
    Inventors: Thornton W. Sargent, IV, Douglas W. Smith
  • Patent number: 6259260
    Abstract: An apparatus for coupling a test head and probe card in a wafer testing system incorporates a number of features that contribute to low impedance and reduced cross-talk, making the coupling apparatus particularly advantageous for high-speed test applications. The coupling apparatus may include, for example, an array of discrete conductor conduits that contain individual conducting elements. The conduits can be insulated, if desired, to reduce leakage. Further, the conduits can be made from metal, and terminated in dielectric interface plates for improved impedance matching. Divider elements can be provided to physically and electrically isolate adjacent rows of conductor conduits. Also, adjacent conducting elements can be connected to carry ground and signal potentials in an alternating manner such that signal carrying elements in a common row are separated from one another by ground carrying elements.
    Type: Grant
    Filed: July 30, 1998
    Date of Patent: July 10, 2001
    Assignee: InTest IP Corporation
    Inventors: Douglas W. Smith, Thornton W. Sargent, IV
  • Patent number: 6249621
    Abstract: A bi-directional interface for transmitting signals between a circuit tester and a connection point proximate to a circuit to be tested includes a first and a second optical fiber link, a first directional gate for coupling both the input end of the first link and the output end of the second link to one endpoint of the interface and a second directional gate for coupling both the input end of the second link and the output end of the first link to the other endpoint of the interface. An optical fiber link for transmitting a signal between a circuit tester and a connection point proximate to a circuit to be tested includes an optical fiber for transmitting the signal, a light source electrically coupled to the link input and optically coupled to the input of the fiber, and a photodetector optically coupled to the fiber output and electrically coupled to the link output. The light source may include a light emitter and a driver stage electrically coupled to the light emitter.
    Type: Grant
    Filed: April 23, 1997
    Date of Patent: June 19, 2001
    Assignee: inTest Sunnyvale Corporation
    Inventors: Thornton W. Sargent, IV, Douglas W. Smith