Abstract: A method is for producing a scattered beam collimator starting from a lower side and extending in a build-up direction as far as an upper side, and having a large number of X-ray absorbing partitions, and in which pass-through channels for unscattered X-ray radiation are embodied between the partitions. A lithographic process is used, by which the partitions of the scattered beam collimator are formed from a photoresist into which an X-ray absorbing material is mixed.

Abstract: An x-ray detector includes a sensor slice for directly converting x-ray radiation and a downstream read-out chip. Further, in at least one embodiment, a first amplifier stage is interconnected between the sensor slice and read-out chip.

Abstract: An X-ray imaging apparatus includes a detection unit, having an X-ray detector and a stray radiation collimator in stacked arrangement, and an X-ray source opposite the detection unit. The X-ray source is embodied, starting from a focal point, to emit X-rays towards the X-ray detector. The X-ray detector has a sensor plane and is subdivided in a first direction into a plurality of detector elements. Each detector element of the plurality of detector elements is embodied to convert the X-rays impinging on a surface region, assigned to the detector element, of the sensor plane into an electrical pixel measurement signal. The stray radiation collimator has a plurality of collimator walls. The collimator walls are arranged over the surface region of a detector element of the plurality of detector elements, such that a shadow cast by a respective collimator wall completely overlaps with the surface region of the corresponding detector element.

Abstract: A photon detector includes at least one sensor element, formed by a semiconductor material and sensitive to incident radiation, forming a pixel array including sensor pixels; and a detector circuit, situated after the sensor element in the direction of incident radiation, to detect charge carriers generated in the semiconductor material as a result of radiation. The detector circuit includes an integrated circuit with detector pixels in signal communication contact with the sensor pixels; and an enclosure surrounding the integrated circuit and in which the integrated circuit is embedded, and on which is formed on a pixel face facing the sensor element. A contact redistribution layer is formed, in which contact pads are formed for signal-communicatively connecting the detector pixels to the correspondingly assigned sensor pixels, and also conductor tracks are formed for connecting the contact pads to the detector pixels of the integrated circuit.

Abstract: A detector apparatus for use as part of a data network includes a plurality of x-ray detectors, each of the plurality of x-ray detectors including a network-capable network interface, and a switch or router, connected to each of the network-capable network interfaces of the plurality of x-ray detectors, each of the plurality of x-ray detectors including a distinct IP address such that the data network is adjustable to take a change in a number of the plurality of x-ray detectors into account. The plurality of x-ray detectors are configured to detect x-rays generated from a single x-ray source.

Abstract: An x-ray detector includes a sensor slice for directly converting x-ray radiation and a downstream read-out chip. Further, in at least one embodiment, a first amplifier stage is interconnected between the sensor slice and read-out chip.

Abstract: A method is for producing a scattered beam collimator starting from a lower side and extending in a build-up direction as far as an upper side, and having a large number of X-ray absorbing partitions, and in which pass-through channels for unscattered X-ray radiation are embodied between the partitions. A lithographic process is used, by which the partitions of the scattered beam collimator are formed from a photoresist into which an X-ray absorbing material is mixed.

Abstract: A method is disclosed for manufacturing a collimator element. The method includes applying a lithographic coating layer. The lithographic coating layer is then exposed using a grid mask. Exposure regions then correspond to a structure of the collimator element. Here, the structure of the collimator element is aligned on a common focus. The lithographic coating layer is then developed to give a pre-structure of the collimator element. Further, an X-ray absorbing layer is applied via cathode sputtering. At least the X-ray absorbing layer is then removed from regions of the pre-structure. A collimator element, a method for manufacturing a scattered-radiation collimator, a scattered-radiation collimator, a radiation detector and a CT device are also disclosed.

Abstract: A radiation detector includes an intermediate layer, which is arranged between a detection layer with a number of detection elements and a number of readout units. In an example embodiment of this arrangement, the intermediate layer has a plurality of electrically-conductive connections between the detection elements and the readout units. An example embodiment further specifies a medical imaging system, as well as a method of using the heating apparatus.

Abstract: An X-ray imaging apparatus includes a detection unit, having an X-ray detector and a stray radiation collimator in stacked arrangement, and an X-ray source opposite the detection unit. The X-ray source is embodied, starting from a focal point, to emit X-rays towards the X-ray detector. The X-ray detector has a sensor plane and is subdivided in a first direction into a plurality of detector elements. Each detector element of the plurality of detector elements is embodied to convert the X-rays impinging on a surface region, assigned to the detector element, of the sensor plane into an electrical pixel measurement signal. The stray radiation collimator has a plurality of collimator walls. The collimator walls are arranged over the surface region of a detector element of the plurality of detector elements, such that a shadow cast by a respective collimator wall completely overlaps with the surface region of the corresponding detector element.

Abstract: An inventive assembly method is for the production of an x-ray detector. In an embodiment, the method includes positioning a plurality of sensor surface elements, formed from an x-ray radiation-sensitive material, on an assembly carrier; placing an interposer on a contact side of each of the plurality of sensor surface elements, divided into a plurality of pixels and arranged opposite the assembly carrier, such that respective contact elements arranged on a mating contact side of the interposer, facing towards respective ones of the plurality of sensor surface elements, each contact a pixel; and respectively putting evaluation circuits on a circuit side of the interposer, opposite to the mating contact side of the interposer, for each of the plurality of sensor surface elements.

Abstract: A detector device includes a cooling air pathway for cooling an X-ray detector. The detector device furthermore includes a detector interior space surrounding the X-ray detector. The cooling air pathway runs through at least one subregion of the detector interior space. The detector device includes a pressure limitation unit with a limitation device arranged along the cooling air pathway. The limitation device is designed, based on an incoming cooling air flow, to route a limited volume flow along the cooling air pathway at the X-ray detector.

Abstract: A counting x-ray detector includes a converter element, a rewiring unit and an evaluation unit including pixel electrodes. In an embodiment, the converter element includes a first electrode on a surface facing away from the evaluation unit and a pixelated second electrode having a plurality of electrode elements on a surface facing toward the evaluation unit. The rewiring unit is on a surface of the converter element facing toward the evaluation unit. First contacts of electrically conductive connections between the electrode elements and the pixel electrodes are provided on a surface of the rewiring unit and include a first areal distribution; and second such contacts are provided on a surface of the rewiring unit, including a relatively smaller second areal distribution. An areal extent of the evaluation unit is relatively smaller than an areal extent of the converter element.

Abstract: A counting X-ray detector includes, in a stacked array, a converter material for converting X-ray radiation into electric charges and an electrode. In an embodiment, the electrode is electrically conductively connected to the converter material. The electrode is designed to be at least partly transparent. In an embodiment, the electrode includes: an electrically conductive contact layer, an electrically conductive first intermediate layer, an electrically conductive high voltage layer, a second intermediate layer and an electrically conductive heating layer.

Abstract: A photon detector includes at least one sensor element, formed by a semiconductor material and sensitive to incident radiation, forming a pixel array including sensor pixels; and a detector circuit, situated after the sensor element in the direction of incident radiation, to detect charge carriers generated in the semiconductor material as a result of radiation. The detector circuit includes an integrated circuit with detector pixels in signal communication contact with the sensor pixels; and an enclosure surrounding the integrated circuit and in which the integrated circuit is embedded, and on which is formed on a pixel face facing the sensor element. A contact redistribution layer is formed, in which contact pads are formed for signal-communicatively connecting the detector pixels to the correspondingly assigned sensor pixels, and also conductor tracks are formed for connecting the contact pads to the detector pixels of the integrated circuit.

Abstract: An X-ray detector unit includes a first stack layer and a second stack layer in a stack arrangement. In an embodiment, the first stack layer includes a converter element to convert incident X-rays into an electrical signal, and includes first electrically conductive contact elements on a contact side facing the second stack layer, in a first number density per unit surface area. The second stack layer includes second electrically conductive contact elements on a counter-contact side facing the first stack layer, of the second stack layer, in a second number density per unit surface area. The first number density is greater than the second number density and each of the second electrically conductive contact elements makes electrically conductive contact with a plurality of first electrically conductive contact elements.

Abstract: A radiation detector includes an intermediate layer, which is arranged between a detection layer with a number of detection elements and a number of readout units. In an example embodiment of this arrangement, the intermediate layer has a plurality of electrically-conductive connections between the detection elements and the readout units. An example embodiment further specifies a medical imaging system, as well as a method of using the heating apparatus.

Abstract: A detector apparatus for use as part of a data network includes a plurality of x-ray detectors, each of the plurality of x-ray detectors including a network-capable network interface, and a switch or router, connected to each of the network-capable network interfaces of the plurality of x-ray detectors, each of the plurality of x-ray detectors including a distinct IP address such that the data network is adjustable to take a change in a number of the plurality of x-ray detectors into account. The plurality of x-ray detectors are configured to detect x-rays generated from a single x-ray source.

Abstract: A radiation detector includes an intermediate layer, which is arranged between a detection layer with a number of detection elements and a number of readout units. In an example embodiment of this arrangement, the intermediate layer has a plurality of electrically-conductive connections between the detection elements and the readout units. An example embodiment further specifies a medical imaging system, as well as a method of using the heating apparatus.

Abstract: An X-ray detector includes a stack arrangement with a scattered radiation grid and a planar converter element including a first surface and a second surface. The converter element includes a first electrode embodied on the first surface and a pixelated second electrode with two adjacent first electrode elements. The two adjacent first electrode elements include a first width and a first length and the two adjacent first electrode elements are embodied the second surface opposite the first surface. The scattered radiation grid includes a grid wall with a thickness along the boundary between the two adjacent first electrode elements. The grid wall is arranged to be substantially perpendicular on the first surface and, in a projection, substantially parallel to the direction of incidence of the radiation and to the surface normal of the first surface. The grid wall at least partially overlaps the two adjacent first electrode elements.