Abstract: A display device includes pixels-arranged in an array with rows and columns, column lines, each connected to the pixels of one of the columns, row lines, each connected to the pixels of one of the rows, and a control unit connected to the column lines and the row lines. The control unit is configured to generate a column pulse for a selected one of the column lines and generate a data signal for a selected row line from the row lines. The data signal includes a set pulse which, when the pixel is set to a radiating state, is applied at least in part to the pixel connected to the selected column and row line when the column pulse is applied to the pixel, and drives the pixel such that a light emission of the pixel depends on the time offset between the column pulse and the set pulse.

Abstract: Display device with of a plurality of pixels (P, P0101, P0102, P0103, P01Y, P0201, P0301, PX01) arranged in an array with rows and columns, a plurality of column lines (C1 . . . CY), each connected to the pixels of one of the columns, a plurality of row lines (L1 . . . LX), each connected to the pixels of one of the rows, a control unit (2) connected to the plurality of column lines and configured to generate a column pulse (CS1 . . . CSY) for a selected one of the plurality of column lines, and connected to the plurality of row lines and configured to generate a data signal (LP1 . . .

Abstract: A display device is disclosed. In an embodiment a display device includes a plurality of image points, each image point comprising at least one active region configured to generate first radiation, a carrier including a drive circuit for the plurality of image points and a detector assigned to at least some image points, the detector configured to receive second radiation, wherein at least some image points are configured to act either as an emitter or as a detector during operation of the display device.

Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned.

Abstract: An arrangement for operating radiation emitting devices includes a plurality of radiation emitting devices each having a first capacitance, a driver circuit that supplies the devices with electrical energy, and a compensation structure having a variable second capacitance corresponding to each device and means for adjusting the respective second capacitance, the compensation structure being connected to the device such that a total capacitance assigned to a device and dependent on the first capacitance can be adjusted by the second capacitance.

Abstract: A method of operating a camera system having an image sensor including a plurality of activatable image elements, wherein an active image element converts incoming radiation into readable image information, a radiation source including a plurality of activatable radiation elements, each active radiation element emitting electromagnetic radiation, and an integrated circuit coupled to the radiation source, the method including capturing at least one image, wherein during capturing of each single image different subsets of the image elements are successively each once activated and deactivated again after a predetermined exposure time, different subsets of the radiation elements are successively activated by the integrated circuit and deactivated again after a predetermined emission time, and each subset of the image elements is assigned a subset of the radiation elements activated with temporal overlap so that the active radiation elements emit radiation while the associated active image elements receive image

Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned.

Abstract: An arrangement includes a semiconductor chip with a first and second electrode. The arrangement also includes a control unit for adjusting a current for operating the semiconductor chip, a first LED voltage input coupled to the first electrode, and a reference voltage input coupled to the second electrode. The arrangement further includes an LED data input coupled to the control unit, by which a data parameter representative of a current for operating the semiconductor chip is provided. The arrangement additionally includes a cycle input coupled to the control unit, by which a reference cycle signal is provided which is representative of an operating phase of the arrangement. The control unit includes a memory arranged to record the data parameter as a memory value depending on the reference cycle signal. The control unit is configured to adjust the current depending on the memory value.

Abstract: An arrangement for operating radiation emitting devices includes a plurality of radiation emitting devices each having a first capacitance, a driver circuit that supplies the devices with electrical energy, and a compensation structure having a variable second capacitance corresponding to each device and means for adjusting the respective second capacitance, the compensation structure being connected to the device such that a total capacitance assigned to a device and dependent on the first capacitance can be adjusted by the second capacitance.

Abstract: A method of operating a camera system having an image sensor including a plurality of activatable image elements, wherein an active image element converts incoming radiation into readable image information, a radiation source including a plurality of activatable radiation elements, each active radiation element emitting electromagnetic radiation, and an integrated circuit coupled to the radiation source, the method including capturing at least one image, wherein during capturing of each single image different subsets of the image elements are successively each once activated and deactivated again after a predetermined exposure time, different subsets of the radiation elements are successively activated by the integrated circuit and deactivated again after a predetermined emission time, and each subset of the image elements is assigned a subset of the radiation elements activated with temporal overlap so that the active radiation elements emit radiation while the associated active image elements receive image

Abstract: A display device is disclosed. In an embodiment a display device includes a plurality of image points, each image point comprising at least one active region configured to generate first radiation, a carrier including a drive circuit for the plurality of image points and a detector assigned to at least some image points, the detector configured to receive second radiation, wherein at least some image points are configured to act either as an emitter or as a detector during operation of the display device.

Abstract: A lightning detection and damage estimation system for a structure is disclosed herein. The system includes a lightning receptor coupled to a lightning conductor configured to receive multiple lightning strikes and induce lightning current in a pick-up coil coupled to the lightning conductor. An integrated circuit coupled to the lightning conductor via the pick-up coil includes a non-volatile memory for successively storing one or more samples of the lightning induced current for the multiple lightning strikes. A damage estimation unit is configured to estimate a condition of the structure based on analyzing a history of stored samples of the lightning induced current of the multiple lightning strikes from the non-volatile memory.

Abstract: A lightning detection and damage estimation system for a structure is disclosed herein. The system includes a lightning receptor coupled to a lightning conductor configured to receive multiple lightning strikes and induce lightning current in a pick-up coil coupled to the lightning conductor. An integrated circuit coupled to the lightning conductor via the pick-up coil includes a non-volatile memory for successively storing one or more samples of the lightning induced current for the multiple lightning strikes. A damage estimation unit is configured to estimate a condition of the structure based on analyzing a history of stored samples of the lightning induced current of the multiple lightning strikes from the non-volatile memory.

Abstract: The invention relates to a self-retaining implant for fixing a bone cover or a bone fragment in an opening in a skull bone. The implant comprises a support element with an upper side and an lower side facing the bone cover. Arranged on the lower side of the support element is an extension, which supports a spike preferably extending parallel to the support element. The spike can be driven laterally into the bone cover or bone fragment by means of a driving-in device according to the invention. The driving-in device according to the invention comprises a receiving element for the implant. A driving-in mechanism for driving the implant into the bone cover or bone fragment can be coupled with the receiving element.

Abstract: The invention concerns a process respectively a device for filling a high pressure gas container (1), comprising the following steps: Supplying a liquefied or solidified first gas (2) into a gas container (1) while the gas container (1) is being cooled; stopping the cooling of the gas container (1) after the supplying step of the first gas; then introducing a gaseous second gas (3) into the gas container (1) and closing the gas container (1). The invention allows for a efficient, reproducible, reliable and economical filling of high pressure gas containers (1), in particular for airbag systems or for fuel cells, and allows to use conventional devices for introducing gases respectively closing gas containers that are not particularly adapted for low temperature respectively high pressure applications.

Abstract: A three-dimensional moulded planar cable, includes a laminate made from at least one conductor track, bonded between two insulation layers and at least one support layer, connected to each other by an adhesive layer. The cable is applied to a positive moulding tool, brought into shape by the application of heat and/or radiation and/or pressure and fixed in the three-dimensional shape thereof by cooling to below the glass temperature Tg of the adhesive layer or by hardening of the adhesive layer.

Abstract: The invention relates to a combined sensor and heating element (1) which is particularly suitable for a motor vehicle seal. Said sensor and heating element comprises a sensor mat which comprises a carrier film (2) and a cover film (3), sensors (6) which are arranged between the carrier film (2) and the cover film (3), and sensor conductor paths, in addition to a heating conductor arrangement. According to the invention, the conductor paths (4) of the heating conductor arrangement are integrated into the sensor mat.

Abstract: The invention relates to a combined sensor and heating element (1) which is suitable, in particular, for the seat of a motor vehicle. Said element comprises a sensor mat provided with a heating arrangement. According to the invention, the sensor mat is embodied as a flexible conductor path comprising a carrier film (2) and conductor paths (4) of a sensor arrangement, which are arranged on the surface of the carrier film (2). The heating conductors (3) of the heating conductor arrangement are arranged on the same carrier film surface between and/or near to the conductor paths (4) of the sensor arrangement.

Abstract: The invention concerns a process, an arrangement and a device for filling a high pressure gas container (1) with liquefied gas, comprising the following steps connecting the gas container to a metering valve (17) and connecting the metering valve (17) to a first container (21) containing liquefied gas, wherein the first container (21) is positions above the gas container (1) at a geodetic height (H); opening the metering valve (17) and admitting the quantity of liquefied gas is supplied with the first container (21) into the gas container (1) at a hydrostatic pressure that corresponds to the geodetic height (H); closing the metering valve (17). As the hydrostatic pressure may be tightly controlled, the high pressure gas container (1) may be efficiently, reproducible, reliable and economically filled at a particularly high metering precision.

Abstract: The invention relates to a three-dimensional flat cable, to a method for the production thereof and to the use thereof. Said flat cable is made of a laminate which comprises at least one conductor path, which is bonded between two insulation layers, and at least one support layer, said layer being connected to each other by means of an adhesive layer. The laminate is placed on a positive forming tool and brought into shape by the application of heat, radiation and/or pressure, and fixed in the three-dimensional shape thereof by cooling to below the glass temperature Tg, of the adhesive layer and/or by reactive hardening of the adhesive layer.