Abstract: The invention relates to a molding mass made from vinyl chloride polymer or polyvinylchloride at 5 to 94 wt. % and a K value of 50 to 90 additives at 2 to 25 wt. % and a polymer, whereby the weight percentages relate to the total weight of the molding mass. The polymer is a semi-crystalline or amorphous polyester. The film is produced from the molding mass by plastifying and fusing the same and calendering or extruding the same to give a film with a thickness of 100 microns to 1 mm. By means of subsequent in-line or off-line method steps, the film, for example, by means of drawing with a drawing degree of 1.3 to 7, can be further processed to give a thin high-shrinkage film.

Abstract: The invention relates to a molding compound including a polyester resin composition, ABS components, waxes, matting agents and optionally vegetable oil, which is used to produce films with a low luster, improved thermal resistance of the film and/or of the surface structure and an increased shrinking onset temperature, in addition to a modified shrinkage progression in comparison to films without the aforementioned additives. The fraction of the polyester resin composition is between 30 and 97 wt. % and the fraction of the additives between 1.5 and 70 wt. %, in relation to the total weight of the molding compound. The films are used as shrink-wrapping and packaging films and films for furniture and printed circuit boards.

Abstract: The invention relates to a molding compound including a polyester resin composition, ABS components, waxes, matting agents and optionally vegetable oil, which is used to produce films with a low luster, improved thermal resistance of the film and/or of the surface structure and an increased shrinking onset temperature, in addition to a modified shrinkage progression in comparison to films without the aforementioned additives. The fraction of the polyester resin composition is between 30 and 97 wt. % and the fraction of the additives between 1.5 and 70 wt. %, in relation to the total weight of the molding compound. The films are used as shrink-wrapping and packaging films and films for furniture and printed circuit boards.

Abstract: The invention relates to a molding mass made from vinyl chloride polymer or polyvinylchloride at 5 to 94 wt. % and a K value of 50 to 90 additives at 2 to 25 wt. % and a polymer, whereby the weight percentages relate to the total weight of the molding mass. The polymer is a semi-crystalline or amorphous polyester. The film is produced from the molding mass by plastifying and fusing the same and calendering or extruding the same to give a film with a thickness of 100 microns to 1 mm. By means of subsequent in-line or off-line method steps, the film, for example, by means of drawing with a drawing degree of 1.3 to 7, can be further processed to give a thin high-shrinkage film.