Patents by Inventor Thorsten Hauck

Thorsten Hauck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package assembly and method of tuning a natural resonant frequency of a package
    Patent number: 8947887
    Abstract: A package assembly comprises an electronic device; a package body; at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from the package body; each of the first plurality of leads being located in corners of the package body; or the first and the second plurality of leads arranged in at least a first row and a second row located in parallel to the first row; each of the rows comprising at least two leads; the first row being transformable into the second row by mirroring the first row along a symmetry plane of the package body; each of the first plurality of leads having the first geometrical shape different from the second geometrical shape.
    Type: Grant
    Filed: February 23, 2009
    Date of Patent: February 3, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Robert Bauer, Thorsten Hauck
  • PACKAGE ASSEMBLY AND METHOD OF TUNING A NATURAL RESONANT FREQUENCY OF A PACKAGE
    Publication number: 20120026716
    Abstract: A package assembly comprises an electronic device; a package body; at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from the package body; each of the first plurality of leads being located in corners of the package body; or the first and the second plurality of leads arranged in at least a first row and a second row located in parallel to the first row; each of the rows comprising at least two leads; the first row being transformable into the second row by mirroring the first row along a symmetry plane of the package body; each of the first plurality of leads having the first geometrical shape different from the second geometrical shape.
    Type: Application
    Filed: February 23, 2009
    Publication date: February 2, 2012
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Robert Bauer, Thorsten Hauck