Patents by Inventor Thorsten Kurz

Thorsten Kurz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10074593
    Abstract: A semiconductor module includes a housing, a circuit carrier having an insulation carrier and a metallization layer applied to a side of the insulation carrier, and a connection lug having a first and second load connection sections and a shunt resistor region. The shunt resistor region is electrically arranged between the first and second load connection sections and connected in series with the first and second load connection sections. The shunt resistor region has an ohmic resistance with a temperature coefficient having an absolute value of less than 0.00002/K at a temperature of 20° C. The connection lug in the region of the second load connection section is electrically conductively connected to a first section of the metallization layer by a first cohesive connection. The first load connection section is led out from the housing and has a free end arranged on the outer side of the housing.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: September 11, 2018
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Kurz, Andreas Schulz
  • Publication number: 20140035605
    Abstract: A semiconductor module includes a housing, a circuit carrier having an insulation carrier and a metallization layer applied to a side of the insulation carrier, and a connection lug having a first and second load connection sections and a shunt resistor region. The shunt resistor region is electrically arranged between the first and second load connection sections and connected in series with the first and second load connection sections. The shunt resistor region has an ohmic resistance with a temperature coefficient having an absolute value of less than 0.00002/K at a temperature of 20° C. The connection lug in the region of the second load connection section is electrically conductively connected to a first section of the metallization layer by a first cohesive connection. The first load connection section is led out from the housing and has a free end arranged on the outer side of the housing.
    Type: Application
    Filed: July 9, 2013
    Publication date: February 6, 2014
    Inventors: Thorsten Kurz, Andreas Schulz
  • Publication number: 20070027874
    Abstract: A common platform computer-based method for repurposing an ontology, comprising the steps of creating an ontology mapping protocol, building a mapping tool based upon the ontology mapping protocol, mapping the ontology onto the common platform using the mapping tool, and, repurposing the ontology based upon the mapping.
    Type: Application
    Filed: September 21, 2006
    Publication date: February 1, 2007
    Inventors: Kilian Stoffel, Thorsten Kurz, Iulian Ciorascu, Claudia Ciorascu, Erik Simon
  • Publication number: 20040117346
    Abstract: A common platform computer-based method for repurposing an ontology, comprising the steps of creating an ontology mapping protocol, building a mapping tool based upon the ontology mapping protocol, mapping the ontology onto the common platform using the mapping tool, and, repurposing the ontology based upon the mapping.
    Type: Application
    Filed: September 19, 2003
    Publication date: June 17, 2004
    Inventors: Kilian Stoffel, Thorsten Kurz, Iulian Ciorascu, Claudia Clorascu, Erik Simon