Patents by Inventor Thorsten Siedler

Thorsten Siedler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module including encapsulation enabling electrical contact therethrough
    Patent number: 10861762
    Abstract: The present disclosure relates to an explosion resistant electronic module having a high-speed interface and a method for electronic contacting of such electronic module via such interface. The electronic module includes an electronic component, an electrical contact area for electrical contacting the electronic component and an encapsulation, which encapsulates at least the electrical contact area. The encapsulation is embodied such that the contact area is contactable through the encapsulation by an electrical contact pin, wherein the encapsulation is filled at least in a portion with a self-healing gelatinous potting compound, which enables the encapsulation to be re-sealed after removal of the contact pin.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: December 8, 2020
    Assignee: Endress+Hauser SE+Co. KG
    Inventors: Bernd Strütt, Christian Strittmatter, Simon Gerwig, Thorsten Siedler, Ralf Leisinger
  • ELECTRONIC MODULE
    Publication number: 20200066610
    Abstract: The present disclosure relates to an explosion resistant electronic module having a high-speed interface and a method for electronic contacting of such electronic module via such interface. The electronic module includes an electronic component, an electrical contact area for electrical contacting the electronic component and an encapsulation, which encapsulates at least the electrical contact area. The encapsulation is embodied such that the contact area is contactable through the encapsulation by an electrical contact pin, wherein the encapsulation is filled at least in a portion with a self-healing gelatinous potting compound, which enables the encapsulation to be re-sealed after removal of the contact pin.
    Type: Application
    Filed: October 30, 2017
    Publication date: February 27, 2020
    Inventors: Bernd Strütt, Christian Strittmatter, Simon Gerwig, Thorsten Siedler, Ralf Leisinger