Patents by Inventor Thorston MEYER

Thorston MEYER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160379945
    Abstract: A semiconductor device and a method of making a semiconductor device are disclosed. The semiconductor device comprises a redistribution layer arranged over a chip, the redistribution layer comprising a first redistribution line. The semiconductor further comprises an isolation layer disposed over the redistribution layer, the isolation layer having a first opening forming a first pad area and a first interconnect located in the first opening and in contact with the first redistribution line.
    Type: Application
    Filed: May 12, 2015
    Publication date: December 29, 2016
    Inventors: Thorston MEYER, Ludwig HEITZER