Patents by Inventor Thortsten Krawinkel

Thortsten Krawinkel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of encapsulating an electronic arrangement
    Patent number: 8771459
    Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: July 8, 2014
    Assignee: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Jan Ellinger, Thortsten Krawinkel, Alexander Steen
  • Method of encapsulating an electronic arrangement
    Patent number: 8557084
    Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: October 15, 2013
    Assignee: Tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Jan Ellinger, Thortsten Krawinkel, Alexander Steen