Abstract: A circuit including headset type detection provides compatibility with different transducer types, such as headphones provided by different manufacturers. An audio circuit that generates or receives an audio signal includes electrical terminals for coupling to a transducer device, at least one of which carries the audio signal. A transducer device type detection circuit is included and detects a type of a transducer device coupled to the audio device from characteristics measured at the multiple electrical terminals when the transducer is coupled to the audio device. The circuit also includes a configuration control circuit for altering a configuration of the audio device according to a detected type of the transducer device.

Abstract: A circuit including headset type detection provides compatibility with different transducer types, such as headphones provided by different manufacturers. An audio circuit that generates or receives an audio signal includes electrical terminals for coupling to a transducer device, at least one of which carries the audio signal. A transducer device type detection circuit is included and detects a type of a transducer device coupled to the audio device from characteristics measured at the multiple electrical terminals when the transducer is coupled to the audio device. The circuit also includes a configuration control circuit for altering a configuration of the audio device according to a detected type of the transducer device.

Abstract: A method of sampling an input signal in a delta-sigma modulator having at least an integrator stage and a feedback digital-to-analog converter (DAC) stage includes sampling an input signal at a sampling rate by alternately utilizing the two sampling capacitors during two sampling cycles such that the two sampling capacitors are each being utilized at half the rate of the sampling rate. Samples from the two sampling capacitors are summed at the sampling rate at an intermediate node with a feedback samples provided by the feedback DAC stage at the sampling rate to generate output samples which are output from integrator stage at the sampling rate.

Abstract: A system and method for distributing power to multiple circuit boards coupled with a “system” backplane is disclosed. Separate redundant pairs of power supplies are provided for each circuit board in a load sharing arrangement. Each set of power supplies and their load, i.e. the circuit board to which they are coupled and providing power to, are isolated from the other sets. The power supplies are coupled with a second “power” backplane which interconnects the redundant power supply pairs as well as receives the input voltage and current from a source and distributes it to all of the power supplies. The power backplane is further coupled with the system backplane in a back to back arrangement to effect the connection of the power supplies with their respective loads. The redundant power supplies in combination with fault monitoring and failure handling logic identify and isolate faults, enable fail-over operation and prevent collateral damage to other system components.

Abstract: A system and method for distributing power to multiple circuit boards coupled with a “system” backplane is disclosed. Separate redundant pairs of power supplies are provided for each circuit board in a load sharing arrangement. Each set of power supplies and their load, i.e. the circuit board to which they are coupled and providing power to, are isolated from the other sets. The power supplies are coupled with a second “power” backplane which interconnects the redundant power supply pairs as well as receives the input voltage and current from a source and distributes it to all of the power supplies. The power backplane is further coupled with the system backplane in a back to back arrangement to effect the connection of the power supplies with their respective loads. The redundant power supplies in combination with fault monitoring and failure handling logic identify and isolate faults, enable fail-over operation and prevent collateral damage to other system components.