Patents by Inventor Thunekazu Yoshino

Thunekazu Yoshino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing liquid crystal display device
    Patent number: 5358810
    Abstract: In a method of manufacturing a liquid crystal display device of this invention, a light transmittance of an overcoating layer of the liquid crystal display device is partially reduced to form a part of a light-shielding portion. Therefore, a color filter can be easily formed, and hence the device can be manufactured at high productivity and low cost.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: October 25, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Thunekazu Yoshino
  • Liquid crystal display device and color filter for use with the liquid crystal display device and method of making the color filter
    Patent number: 5190794
    Abstract: A color filter for use with a liquid crystal display is disclosed. The color filter has colored layers printed on a transparent substrate and first and second resin layers coated on the colored layers.
    Type: Grant
    Filed: May 31, 1991
    Date of Patent: March 2, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Thunekazu Yoshino, Tomiya Sonoda
  • Liquid crystal display device and color filter for use with the liquid crystal display device with two resin layers over the color filter
    Patent number: 5042920
    Abstract: A color filter for use with a liquid crystal display is disclosed. The color filter has colored layers printed on a transparent substrate and first and second resin layers coated on the colored layers.
    Type: Grant
    Filed: November 9, 1989
    Date of Patent: August 27, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Thunekazu Yoshino, Tomiya Sonoda
  • Bonding sheet for electronic component and method of bonding electronic component using the same
    Patent number: 4887760
    Abstract: The bonding sheet of the present invention comprises a substrate having an opening, and a low-melting point bonding metal which closes the opening or is arranged on the peripheral portion of the opening, to project in the opening. According to a bonding sheet of the present invention, a low-melting point bonding metal is interposed between a conductor pattern of a substrate and electrode terminals of an electronic component, and is bonded by thermocompression at a low temperature without melting the low-melting point bonding metal, so that bonding of a large number of electrode terminals can be completed by a single bonding operation.
    Type: Grant
    Filed: August 27, 1987
    Date of Patent: December 19, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Thunekazu Yoshino, Hiroshi Morita, Hirotaka Nakano, Nobuo Hayashi, Yuko Kubota
  • Film carrier and bonding method using the film carrier
    Patent number: 4857671
    Abstract: A film carrier according to this invention comprises a base film, a plurality of conductors formed on the base film, and a plurality of layers formed on the conductors, each being made of a low-melting point bonding metal. A bonding method of this invention comprises the steps of aligning the bonding metal layers of the film carrier with the terminals of an electronic part, and half-melting the bonding metal layers by thermocompression, thereby to electrically connect the conductors of the film carrier to the terminals of the electronic part. The object of the present invention is to provide a film carrier which can serve to connect electronic parts to a circuit by means of a low pressure and at a low temperature, without causing damage to the electronic parts such as semiconductor elements, and also a bonding method using this film carrier.
    Type: Grant
    Filed: October 17, 1988
    Date of Patent: August 15, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hirotaka Nakano, Thunekazu Yoshino
  • Film carrier and bonding method using the film carrier
    Patent number: 4808769
    Abstract: A film carrier according to this invention comprises a base film, a plurality of conductors formed on the base film, and a plurality of layers formed on the conductors, each being made of a low-melting point bonding metal. A bonding method of this invention comprises the steps of aligning the bonding metal layers of the film carrier with the terminals of an electronic part, and half-melting the bonding metal layers by thermo-compression, thereby to electrically connect the conductors of the film carrier to the terminals of the electronic part. The object of the present invention is to provide a film carrier which can serve to connect electronic parts to a circuit by means of a low pressure and at a low temperature, without causing damage to the electronic parts such as semiconductor elements, and also a bonding method using this film carrier.
    Type: Grant
    Filed: September 25, 1987
    Date of Patent: February 28, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hirotaka Nakano, Thunekazu Yoshino