Abstract: A fabrication method and structure of array nozzles on thermal inkjet print head is provided. Volcano shape array nozzles and inkjet vaporization chambers with accurate alignment to the individual positions of micro-heating elements on the wafer surface are obtained by using lithography and copper plating methods. The nozzles are made of (photolithographic) polymer materials, such as polyimide, being susceptible to operate in elevated temperature. The size and location of all nozzles can be defined accurately and simultaneously by a masked lithographic process, so that excellent dimension control over all nozzles can be achieved for quality inkjet printing. The extended shape to the outer surface of the nozzle plate can be engraved by another masked process into a tilting angle, in order to meet requirement of fluid dynamic for better ink jetting.

Abstract: The present invention discloses a packaging structure of LED-multiplexer/driver hybridization for LED printer head. In order to connect the LED-multiplexer module to the LED chip without wire bonding, a multiplexer chip, made of silicon material, has multiplexer circuit on one side and a through engraved U-shape trench on the other side, a linear array LED chip, made of non-silicon material, is stack-hybridized into the through engraved U-shape trench, to form a hybridized wafer with all the upper surfaces of LEDs and the multiplexer circuit in the same plane to form a co-planar surface. A plurality of joint-metal, made by photo-lithography and etching, screen printing of any solder paste, ink-jet printing of any appropriate solder paste or by lift-off method, is formed on said co-planar surface of said multiplexer circuit and linear array LED to connect the bonding pad of the multiplexer device and the positive electrode of the LED of each pixel.