Patents by Inventor Thuong A. Huynh

Thuong A. Huynh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200005967
    Abstract: Probe assembly includes an ultrasound probe and a cable assembly configured to communicatively couple the ultrasound probe to a control system and transmit signals therethrough. The cable assembly includes a cable jacket surrounding a channel of the cable assembly. The cable assembly also includes a plurality of wire pairs extending through the channel. The channel being sized and shaped to permit the wire pairs to move relative to one another within the channel when the probe assembly is moved. The wire pairs and the channel are configured to have a designated pack ratio (AreaWPS/AreaC). The AreaWPS includes a collective cross-sectional area of the wire pairs, and the AreaC is equal to a cross-sectional area of the channel.
    Type: Application
    Filed: September 9, 2019
    Publication date: January 2, 2020
    Inventors: Arthur G. Buck, Paul C. Sprunger, Kevin T. Lewis, Yevgeniy Mayevskiy, Thomas J. Medina, Thuong A. Huynh
  • Patent number: 10410768
    Abstract: Probe assembly includes an ultrasound probe and a cable assembly configured to communicatively couple the ultrasound probe to a control system and transmit signals therethrough. The cable assembly includes a cable jacket surrounding a channel of the cable assembly. The cable assembly also includes a plurality of wire pairs extending through the channel. The channel being sized and shaped to permit the wire pairs to move relative to one another within the channel when the probe assembly is moved. The wire pairs and the channel are configured to have a designated pack ratio (AreaWPS/AreaC). The AreaWPS includes a collective cross-sectional area of the wire pairs, and the AreaC is equal to a cross-sectional area of the channel.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: September 10, 2019
    Assignee: GREGANNA UNLIMITED COMPANY
    Inventors: Arthur G. Buck, Paul C. Sprunger, Kevin T. Lewis, Yevgeniy Mayevskiy, Thomas J. Medina, Thuong A. Huynh
  • Publication number: 20180247741
    Abstract: Probe assembly includes an ultrasound probe and a cable assembly configured to communicatively couple the ultrasound probe to a control system and transmit signals therethrough. The cable assembly includes a cable jacket surrounding a channel of the cable assembly. The cable assembly also includes a plurality of wire pairs extending through the channel. The channel being sized and shaped to permit the wire pairs to move relative to one another within the channel when the probe assembly is moved. The wire pairs and the channel are configured to have a designated pack ratio (AreaWPS/AreaC). The AreaWPS includes a collective cross-sectional area of the wire pairs, and the AreaC is equal to a cross-sectional area of the channel.
    Type: Application
    Filed: October 27, 2017
    Publication date: August 30, 2018
    Inventors: Arthur G. Buck, Paul C. Sprunger, Kevin T. Lewis, Yevgeniy Mayevskiy, Thomas J. Medina, Thuong A. Huynh
  • Patent number: 10037834
    Abstract: A cable (210) includes a center conductor (220). An insulating material in the form of a layer (225) surrounds the center conductor. A sparse shield (232) partially surrounds the insulating material. The sparse shield may include a plurality of conductors, which are grouped adjacent to one another within a space around the insulating layer that has a length that is less than 25% of the total circumference of the insulating layer. An insulating jacket (227) covers the sparse shield and the remainder of the cable. The cable may be used in a cable assembly (10).
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: July 31, 2018
    Assignee: CREGANNA UNLIMITED COMPANY
    Inventors: Arthur G. Buck, Yevgeniy Mayevskiy, Malai H. Khamphilavong, Thuong A. Huynh, Paul C. Sprunger
  • Patent number: 9991023
    Abstract: A cable assembly includes a plurality of wires. Each wire has a first end, intermediate section, and a second end. The intermediate sections of the respective wires are detached from each other. A conductive shield surrounds the respective intermediate sections of the plurality of wires. Each wire includes a conductor, an insulating layer that surrounds the conductor, and a conductive coating formed on an outside surface of the insulating layer.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: June 5, 2018
    Assignee: CREGANNA UNLIMITED COMPANY
    Inventors: Arthur G. Buck, Yevgeniy Mayevskiy, Malai H. Khamphilavong, Thuong A. Huynh
  • Publication number: 20150371738
    Abstract: A cable (210) includes a center conductor (220). An insulating material in the form of a layer (225) surrounds the center conductor. A sparse shield (232) partially surrounds the insulating material. The sparse shield may include a plurality of conductors, which are grouped adjacent to one another within a space around the insulating layer that has a length that is less than 25% of the total circumference of the insulating layer. An insulating jacket (227) covers the sparse shield and the remainder of the cable. The cable may be used in a cable assembly (10).
    Type: Application
    Filed: January 29, 2014
    Publication date: December 24, 2015
    Applicant: Tyco Electronics Corporation
    Inventors: Arthur G. Buck, Yevgeniy Mayevskiy, Malai H. Khamphilavong, Thuong A. Huynh, Paul C. Sprunger
  • Publication number: 20140209346
    Abstract: A cable assembly includes a plurality of wires. Each wire has a first end, intermediate section, and a second end. The intermediate sections of the respective wires are detached from each other. A conductive shield surrounds the respective intermediate sections of the plurality of wires. Each wire includes a conductor, an insulating layer that surrounds the conductor, and a conductive coating formed on an outside surface of the insulating layer.
    Type: Application
    Filed: January 29, 2013
    Publication date: July 31, 2014
    Applicant: Tyco Electronics Corporation
    Inventors: Arthur G. Buck, Yevgeniy Mayevskiy, Malai H. Khamphilavong, Thuong A. Huynh