Abstract: A microelectronic system including hydrogen barriers and copper pillars for wafer level packaging and method of fabricating the same are provided. Generally, the method includes: forming an insulating hydrogen barrier over a surface of a first chip; exposing at least a portion of an electrical contact electrically coupled to a component in the first chip by removing a portion of the insulating hydrogen barrier, the component including a material susceptible to degradation by hydrogen; forming a conducting hydrogen barrier over at least the exposed portion of the electrical contact; and forming a copper pillar over the conducting hydrogen barrier. In one embodiment, the material susceptible to degradation is lead zirconate titanate (PZT) and the microelectronic systems device is a ferroelectric random access memory including a ferroelectric capacitor with a PZT ferroelectric layer. Other embodiments are also disclosed.

Abstract: An improved ESD protection device, integrated circuit and method for programmably altering a sensitivity of the ESD protection device is provided herein. More specifically, an active shunt ESD protection device is provided with an improved trigger circuit design. The improved trigger circuit design enables the sensitivity of the ESD protection device to be altered by providing a variety of programmable elements for adjusting an RC time constant of a slew rate detector contained therein. The programmable elements allow the RC time constant to be altered at the wafer or package level, and avoid the significant time and cost typically associated with conventional trial-and-error adjustment procedures.

Abstract: A non-planar frame base for an image sensor.

Abstract: An improved ESD protection device, integrated circuit and method for programmably altering a sensitivity of the ESD protection device is provided herein. More specifically, an active shunt ESD protection device is provided with an improved trigger circuit design. The improved trigger circuit design enables the sensitivity of the ESD protection device to be altered by providing a variety of programmable elements for adjusting an RC time constant of a slew rate detector contained therein. The programmable elements allow the RC time constant to be altered at the wafer or package level, and avoid the significant time and cost typically associated with conventional trial-and-error adjustment procedures.