Abstract: A semiconductor chip for mounting on a package substrate by a flip-chip process includes a plurality of electrode pads of a first group provided on a major surface of the semiconductor chip for external electrical connection such that the electrode pads of the first group cover a major surface of the semiconductor chip in rows and columns; and a plurality of electrode pads of a second group each having a size substantially larger than the electrode pads of the first group and provided on the major surface of the semiconductor chip in electrical connection with an active part of the semiconductor chip that is used for a burn-in process. Each of the electrode pads of the first group is covered by a solder bump that projects from the major surface of the semiconductor chip a first distance.

Abstract: A package and socket unit for testing a pin grid array package which includes a package having a plurality of pads electrically connected to pins and surrounding an area in which the pins are arranged, and a socket having contacts adapted to be electrically connected to the pads and provided with a chamber in which the pins are received without contact between the walls and the bottom of the chamber. The unit also may include a carrier for holding the package in the socket.