Patents by Inventor Thuy Britcher

Thuy Britcher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11276562
    Abstract: A system for modifying the uniformity pattern of a thin film deposited in a plasma processing chamber includes a single radio-frequency (RF) power source that is coupled to multiple points on the discharge electrode of the plasma processing chamber. Positioning of the multiple coupling points, a power distribution between the multiple coupling points, or a combination of both are selected to at least partially compensate for a consistent non-uniformity pattern of thin films produced by the chamber. The power distribution between the multiple coupling points may be produced by an appropriate RF phase difference between the RF power applied at each of the multiple coupling points.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: March 15, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Zheng John Ye, Ganesh Balasubramanian, Thuy Britcher, Jay D. Pinson, II, Hiroji Hanawa, Juan Carlos Rocha-Alvarez, Kwangduk Douglas Lee, Martin Jay Seamons, Bok Hoen Kim, Sungwon Ha
  • Patent number: 11107704
    Abstract: A substrate processing system includes a processing chamber that includes a substrate support positioned therein. The substrate processing system includes a valve system fluidly coupled to the processing chamber and configured to control flow of gas into the processing chamber. The valve system includes a primary flow line and a first gas source flow line fluidly coupled to the primary flow line through a first gas source valve. The valve system includes a second gas source flow line fluidly coupled to the primary flow line through a second gas source valve. The first gas source valve and the second gas source valve are positioned in series within the primary flow line.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: August 31, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Tejas Ulavi, Thuy Britcher, Amit Kumar Bansal
  • Publication number: 20200203132
    Abstract: A system for modifying the uniformity pattern of a thin film deposited in a plasma processing chamber includes a single radio-frequency (RF) power source that is coupled to multiple points on the discharge electrode of the plasma processing chamber. Positioning of the multiple coupling points, a power distribution between the multiple coupling points, or a combination of both are selected to at least partially compensate for a consistent non-uniformity pattern of thin films produced by the chamber. The power distribution between the multiple coupling points may be produced by an appropriate RF phase difference between the RF power applied at each of the multiple coupling points.
    Type: Application
    Filed: March 2, 2020
    Publication date: June 25, 2020
    Inventors: Zheng John YE, Ganesh BALASUBRAMANIAN, Thuy BRITCHER, Jay D. PINSON, II, Hiroji HANAWA, Juan Carlos ROCHA-ALVAREZ, Kwangduk Douglas LEE, Martin Jay SEAMONS, Bok Hoen KIM, Sungwon HA
  • Publication number: 20200075353
    Abstract: A substrate processing system includes a processing chamber that includes a substrate support positioned therein. The substrate processing system includes a valve system fluidly coupled to the processing chamber and configured to control flow of gas into the processing chamber. The valve system includes a primary flow line and a first gas source flow line fluidly coupled to the primary flow line through a first gas source valve. The valve system includes a second gas source flow line fluidly coupled to the primary flow line through a second gas source valve. The first gas source valve and the second gas source valve are positioned in series within the primary flow line.
    Type: Application
    Filed: July 23, 2019
    Publication date: March 5, 2020
    Inventors: Tejas ULAVI, Thuy BRITCHER, Amit Kumar BANSAL
  • Patent number: 10580623
    Abstract: A system for modifying the uniformity pattern of a thin film deposited in a plasma processing chamber includes a single radio-frequency (RF) power source that is coupled to multiple points on the discharge electrode of the plasma processing chamber. Positioning of the multiple coupling points, a power distribution between the multiple coupling points, or a combination of both are selected to at least partially compensate for a consistent non-uniformity pattern of thin films produced by the chamber. The power distribution between the multiple coupling points may be produced by an appropriate RF phase difference between the RF power applied at each of the multiple coupling points.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: March 3, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Zheng John Ye, Ganesh Balasubramanian, Thuy Britcher, Jay D. Pinson, II, Hiroji Hanawa, Juan Carlos Rocha-Alvarez, Kwangduk Douglas Lee, Martin Jay Seamons, Bok Hoen Kim, Sungwon Ha
  • Patent number: 10276353
    Abstract: A method and apparatus for a dual-channel showerhead is provided. In one embodiment the showerhead comprises a body comprising a conductive material having a plurality of first openings formed therethrough comprising a first gas channel and a plurality of second openings formed therethrough comprising a second gas channel that is fluidly separated from the first gas channel, wherein each of the first openings having a geometry that is different than each of the second openings.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: April 30, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kaushik Alayavalli, Xinhai Han, Praket P. Jha, Masaki Ogata, Zhijun Jiang, Allen Ko, Ndanka O. Mukuti, Thuy Britcher, Amit Kumar Bansal, Ganesh Balasubramanian, Juan Carlos Rocha-Alvarez, Bok Hoen Kim
  • Publication number: 20160322200
    Abstract: A method and apparatus for a dual-channel showerhead is provided. In one embodiment the showerhead comprises a body comprising a conductive material having a plurality of first openings formed therethrough comprising a first gas channel and a plurality of second openings formed therethrough comprising a second gas channel that is fluidly separated from the first gas channel, wherein each of the first openings having a geometry that is different than each of the second openings.
    Type: Application
    Filed: April 29, 2016
    Publication date: November 3, 2016
    Inventors: Kaushik ALAYAVALLI, Xinhai HAN, Praket P. JHA, Masaki OGATA, Zhijun JIANG, Allen KO, Ndanka O. MUKUTI, Thuy BRITCHER, Amit Kumar BANSAL, Ganesh BALASUBRAMANIAN, Juan Carlos ROCHA-ALVAREZ, Bok Hoen KIM
  • Publication number: 20100084023
    Abstract: Embodiments described herein provide an application for delivery of fluids within substrate processing systems. More particularly, embodiments described herein provide applications for delivery of processing chemicals within substrate processing systems. In one embodiment, a fluid delivery system is provided. The fluid delivery system comprises a bulk fluid source for supplying fluids, a fluid delivery module for controlling and monitoring a ratio of fluids flowing from the bulk fluid source, a first stream line positioned downstream from the fluid delivery module, a first switch positioned along the first stream line, a second stream line positioned downstream from the fluid delivery module, and a second switch positioned along the second stream line, wherein the fluid delivery module splits the fluids from the bulk fluid source into two streams flowing through the first stream line and the second stream line according to a pre-defined ratio.
    Type: Application
    Filed: October 7, 2008
    Publication date: April 8, 2010
    Inventors: Chris Melcer, Thuy Britcher, Avi Tepman, Simon Y. Yavelberg, Sheshraj L. Tulshibagwale
  • Publication number: 20090320875
    Abstract: Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In one embodiment, an apparatus for cleaning multiple substrates is provided. The apparatus comprises an outer tank for collecting overflow processing fluid comprising at least one sidewall and a bottom. A first inner module adapted to contain a processing fluid is positioned partially within the outer tank. The first inner module comprises one or more roller assemblies to hold a substrate in a substantially vertical orientation. A second inner module adapted to contain a processing fluid is positioned partially within the outer tank. The second inner module comprises one or more roller assemblies adapted to hold a substrate in a substantially vertical orientation. Each inner module contains a transducer adapted to direct vibrational energy through the processing fluid toward the substrates.
    Type: Application
    Filed: June 23, 2009
    Publication date: December 31, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: RICARDO MARTINEZ, Allen L. D'Ambra, Adrian Blank, Thuy Britcher, Hui Chen