Patents by Inventor Thuy Tran-Quinn

Thuy Tran-Quinn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER HANDLER FOR INFRARED LASER RELEASE
    Publication number: 20170170048
    Abstract: A wafer handler includes a substrate having a front surface and a back surface, an antireflective layer formed over the back surface, a silicon nitride compensation layer formed over the front surface, and a release layer formed over the compensation layer. The wafer handler can be bonded to a device wafer for processing of the device wafer, and debonded from the device wafer using infrared radiation without damaging the device wafer or devices formed thereon.
    Type: Application
    Filed: December 9, 2015
    Publication date: June 15, 2017
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Thuy Tran-Quinn, Daewon Yang, Matthew S. Angyal, Dennis M. Sheehan
  • Solder ball contact susceptible to lower stress
    Patent number: 8614512
    Abstract: A solder ball contact and a method of making a solder ball contact includes: a first insulating layer with a via formed on an integrated circuit (IC) chip and a metal pad; an under bump metallurgy (UBM) structure disposed within the via and on a portion of the first insulating layer, surrounding the via; a second insulating layer formed on an upper surface of an outer portion of the UBM structure that is centered on the via; and a solder ball that fills the via and is disposed above an upper surface of an inner portion of the UBM structure that contacts the via, in which the UBM structure that underlies the solder ball is of a greater diameter than the solder ball.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: December 24, 2013
    Assignee: International Business Machines Corporation
    Inventors: Luc Guerin, Mario J. Interrante, Michael J. Shapiro, Thuy Tran-Quinn, Van T. Truong
  • Solder ball contact susceptible to lower stress
    Patent number: 8383505
    Abstract: A solder ball contact and a method of making a solder ball contact includes: a first insulating layer with a via formed on an integrated circuit (IC) chip and a metal pad; an under bump metallurgy (UBM) structure disposed within the via and on a portion of the first insulating layer, surrounding the via; a second insulating layer formed on an upper surface of an outer portion of the UBM structure that is centered on the via; and a solder ball that fills the via and is disposed above an upper surface of an inner portion of the UBM structure that contacts the via, in which the UBM structure that underlies the solder ball is of a greater diameter than the solder ball.
    Type: Grant
    Filed: April 5, 2011
    Date of Patent: February 26, 2013
    Assignee: International Business Machines Corporation
    Inventors: Luc Guerin, Mario J. Interrante, Michael J. Shapiro, Thuy Tran-Quinn, Van T. Truong
  • SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS
    Publication number: 20130015579
    Abstract: A solder ball contact and a method of making a solder ball contact includes: a first insulating layer with a via formed on an integrated circuit (IC) chip and a metal pad; an under bump metallurgy (UBM) structure disposed within the via and on a portion of the first insulating layer, surrounding the via; a second insulating layer formed on an upper surface of an outer portion of the UBM structure that is centered on the via; and a solder ball that fills the via and is disposed above an upper surface of an inner portion of the UBM structure that contacts the via, in which the UBM structure that underlies the solder ball is of a greater diameter than the solder ball.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 17, 2013
    Applicant: International Business Machines Corporation
    Inventors: Luc Guerin, Mario J. Interrante, Michael J. Shapiro, Thuy Tran-Quinn, Van T. Truong
  • SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS
    Publication number: 20120256313
    Abstract: A solder ball contact and a method of making a solder ball contact includes: a first insulating layer with a via formed on an integrated circuit (IC) chip and a metal pad; an under bump metallurgy (UBM) structure disposed within the via and on a portion of the first insulating layer, surrounding the via; a second insulating layer formed on an upper surface of an outer portion of the UBM structure that is centered on the via; and a solder ball that fills the via and is disposed above an upper surface of an inner portion of the UBM structure that contacts the via, in which the UBM structure that underlies the solder ball is of a greater diameter than the solder ball.
    Type: Application
    Filed: April 5, 2011
    Publication date: October 11, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Luc Guerin, Mario J. Interrante, Michael J. Shapiro, Thuy Tran-Quinn, Van T. Truong