Patents by Inventor Ti-Jun WANG

Ti-Jun WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12253314
    Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively. The maximum length of the front section is greater than that of the middle section, and the maximum length of the middle section is greater than that of the rear section.
    Type: Grant
    Filed: September 20, 2023
    Date of Patent: March 18, 2025
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Sheng-Hua Luo, Ti-Jun Wang
  • Publication number: 20240011719
    Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively. The maximum length of the front section is greater than that of the middle section, and the maximum length of the middle section is greater than that of the rear section.
    Type: Application
    Filed: September 20, 2023
    Publication date: January 11, 2024
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sheng-Hua LUO, Ti-Jun WANG
  • Publication number: 20230339053
    Abstract: A vapor chamber with a support structure is provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Application
    Filed: June 27, 2023
    Publication date: October 26, 2023
    Inventors: Shih-Lin HUANG, Sien WU, Baoxun HE, Ti-Jun WANG
  • Patent number: 11796259
    Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively, the maximum length of the middle section is greater than that of the front section and that of the rear section so as to be used as the evaporator of the heat pipe.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: October 24, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Sheng-Hua Luo, Ti-Jun Wang
  • Patent number: 11731220
    Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: August 22, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Sien Wu, Baoxun He, Ti-Jun Wang
  • Publication number: 20230168046
    Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively, the maximum length of the middle section is greater than that of the front section and that of the rear section so as to be used as the evaporator of the heat pipe.
    Type: Application
    Filed: January 12, 2023
    Publication date: June 1, 2023
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sheng-Hua LUO, Ti-Jun WANG
  • Patent number: 11598585
    Abstract: A heat pipe comprises a tube and a wick structure. The tube includes a hollow chamber and has two sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the tube. The wick structure has a first section near one of the sealed ends, a third section near the other of the sealed ends, and a second section between the first and third sections. The wick structure is composed of the first, the second and the third sections, and cross-sections of the first section, the second section and the third section in the axial direction are rectangles, respectively. A cross-sectional area of the first section is greater than that of the second and that of third section. The edge of each of the sections of the wick structure has a smooth form without the sectional difference.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: March 7, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Sheng-Hua Luo, Ti-Jun Wang
  • Publication number: 20210247153
    Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Application
    Filed: April 28, 2021
    Publication date: August 12, 2021
    Inventors: Shih-Lin HUANG, Sien WU, Baoxun HE, Ti-Jun WANG
  • Publication number: 20210222958
    Abstract: A heat pipe comprises a tube and a wick structure. The tube includes a hollow chamber and has two sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the tube. The wick structure has a first section near one of the sealed ends, a third section near the other of the sealed ends, and a second section between the first and third sections. The wick structure is composed of the first, the second and the third sections, and cross-sections of the first section, the second section and the third section in the axial direction are rectangles, respectively. A cross-sectional area of the first section is greater than that of the second and that of third section. The edge of each of the sections of the wick structure has a smooth form without the sectional difference.
    Type: Application
    Filed: April 6, 2021
    Publication date: July 22, 2021
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sheng-Hua LUO, Ti-Jun WANG
  • Patent number: 10724803
    Abstract: A heat pipe is provided, including a capillary body. The capillary body has a condensation portion, an evaporation portion, and a connecting portion connecting the condensation portion with the evaporation portion. The capillary body is formed by metal weaving. A cross-section of the evaporation portion is larger than that of the condensation portion.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: July 28, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Ti-Jun Wang, Quan Zhang
  • Patent number: 10520260
    Abstract: A heat pipe is divided into an evaporation section, an insulation section and a condensation section. The insulation section includes a pipe section and a liquid delivery structure. The pipe section has a top wall and a bottom wall. The liquid delivery structure is a solid structure and in contact with the top and bottom walls of the pipe section. The liquid delivery structure and the top and bottom walls of the pipe section form a vapor channel. The liquid delivery structure is divided into a center portion and an outer layer, and the center portion has a porosity greater than the porosity of the outer layer. The outer layer is coupled to the center portion, and the center portion and the vapor channel are spaced from one another, so as to achieve the liquid and vapor isolation and improve the heat conducting effect of the heat pipe.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: December 31, 2019
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Ti-Jun Wang
  • Publication number: 20190376748
    Abstract: A heat pipe comprises a tube and a wick structure. The tube includes a hollow chamber and has two sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the tube. The wick structure has a first section near one of the sealed ends, a third section near the other of the sealed ends, and a second section between the first and third sections. The second section is greater than the first and third sections.
    Type: Application
    Filed: August 23, 2019
    Publication date: December 12, 2019
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sheng-Hua LUO, Ti-Jun WANG
  • Publication number: 20190249938
    Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 15, 2019
    Inventors: Shih-Lin HUANG, Sien WU, Baoxun HE, Ti-Jun WANG
  • Patent number: 10145619
    Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: December 4, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Sien Wu, Ti-Jun Wang
  • Publication number: 20180038659
    Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
    Type: Application
    Filed: October 13, 2017
    Publication date: February 8, 2018
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sien WU, Ti-Jun WANG
  • Publication number: 20170343299
    Abstract: A heat pipe is provided, including a capillary body. The capillary body has a condensation portion, an evaporation portion, and a connecting portion connecting the condensation portion with the evaporation portion. The capillary body is formed by metal weaving. A cross-section of the evaporation portion is larger than that of the condensation portion.
    Type: Application
    Filed: January 3, 2017
    Publication date: November 30, 2017
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Ti-Jun WANG, Quan ZHANG
  • Publication number: 20160201992
    Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
    Type: Application
    Filed: May 5, 2015
    Publication date: July 14, 2016
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sien WU, Ti-Jun WANG
  • Publication number: 20160153722
    Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. Two ends of first pipe along an axial direction of the heat pipe are sealed. The second pipe is disposed in the hollow chamber and includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. The hollow chamber of the first pipe is mainly a channel for vapor, the second pipe is mainly a channel for working fluid, the vapor is driven by the vapor pressure difference to move in the first pipe and from the evaporator to the condenser, and the working fluid is driven by the vapor pressure difference to flow in the second pipe and from the condenser to the evaporator.
    Type: Application
    Filed: July 7, 2015
    Publication date: June 2, 2016
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sien WU, Ti-Jun WANG
  • Publication number: 20160153723
    Abstract: A heat pipe comprises a pipe and at least a wick structure. The pipe includes a hollow chamber. The wick structure is disposed in the hollow chamber and extended along an axial direction of the pipe. A section of the wick structure along the axial direction is not a uniform section between two ends of the pipe.
    Type: Application
    Filed: August 5, 2015
    Publication date: June 2, 2016
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sheng-Hua LUO, Ti-Jun WANG
  • Publication number: 20160153720
    Abstract: A heat pipe is divided into an evaporation section, an insulation section and a condensation section. The insulation section includes a pipe section and a liquid delivery structure. The pipe section has a top wall and a bottom wall. The liquid delivery structure is a solid structure and in contact with the top and bottom walls of the pipe section. The liquid delivery structure and the top and bottom walls of the pipe section form a vapor channel. The liquid delivery structure is divided into a center portion and an outer layer, and the center portion has a porosity greater than the porosity of the outer layer. The outer layer is coupled to the center portion, and the center portion and the vapor channel are spaced from one another, so as to achieve the liquid and vapor isolation and improve the heat conducting effect of the heat pipe.
    Type: Application
    Filed: January 30, 2015
    Publication date: June 2, 2016
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Ti-Jun WANG